
AMD Xilinx
XQR4036XL-3CB228M
XQR4036XL-3CB228M ECAD Model
XQR4036XL-3CB228M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 288 | |
Number of Outputs | 288 | |
Number of Logic Cells | 3078 | |
Number of Equivalent Gates | 22000 | |
Number of CLBs | 1296 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1296 CLBS, 22000 GATES | |
Additional Feature | TYPICAL GATES = 22000 TO 65000 | |
Clock Frequency-Max | 166 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-CQFP-F228 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Total Dose | 60k Rad(Si) V | |
Number of Terminals | 228 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | GQFF | |
Package Equivalence Code | TPAK228,2.5SQ,25 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, GUARD RING | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | FLAT | |
Terminal Pitch | 635 µm | |
Terminal Position | QUAD | |
Width | 39.37 mm | |
Length | 39.37 mm | |
Seated Height-Max | 3.302 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | GQFF, TPAK228,2.5SQ,25 | |
Pin Count | 228 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.2.C |
XQR4036XL-3CB228M Datasheet Download
XQR4036XL-3CB228M Overview
The XQR4036XL-3CB228M chip model is a revolutionary product in the semiconductor industry, offering a variety of advantages that make it a preferred choice for many applications. It is designed to provide a high level of performance in various applications, such as communication systems, consumer electronics, automotive, and industrial applications.
The XQR4036XL-3CB228M chip model has several advantages that make it an ideal choice for many applications. It is a low-power, high-performance, and highly reliable device that is designed to meet the needs of both consumer and industrial markets. It is also designed to be cost-effective and energy-efficient, making it an ideal choice for applications that require a low-power solution. Additionally, it is designed to be highly compatible with a variety of communication systems, making it suitable for a wide range of applications.
The XQR4036XL-3CB228M chip model is designed to provide an efficient and reliable solution for many applications. It is designed to provide a high-performance solution that is energy-efficient and cost-effective. It is designed to be highly compatible with a variety of communication systems, making it suitable for a wide range of applications. Additionally, it is designed to be highly reliable and durable, making it an ideal choice for applications that require a long-term solution.
The XQR4036XL-3CB228M chip model is designed to meet the needs of both consumer and industrial markets. It is designed to provide a high-performance solution that is energy-efficient and cost-effective. Additionally, it is designed to be highly compatible with a variety of communication systems, making it suitable for a wide range of applications. It is also designed to be highly reliable and durable, making it an ideal choice for applications that require a long-term solution.
The XQR4036XL-3CB228M chip model is designed to meet the needs of both consumer and industrial markets. It is designed to provide a high-performance solution that is energy-efficient and cost-effective. Additionally, it is designed to be highly compatible with a variety of communication systems, making it suitable for a wide range of applications. It is also designed to be highly reliable and durable, making it an ideal choice for applications that require a long-term solution.
The product description and specific design requirements of the XQR4036XL-3CB228M chip model are as follows. It is a low-power, high-performance, and highly reliable device that is designed to meet the needs of both consumer and industrial markets. It is designed to provide a high-performance solution that is energy-efficient and cost-effective, making it an ideal choice for applications that require a low-power solution. Additionally, it is designed to be highly compatible with a variety of communication systems, making it suitable for a wide range of applications.
In terms of future demand trends for the XQR4036XL-3CB228M chip model, the demand for this chip model is expected to remain strong in the future. This is due to its high performance, energy efficiency, cost-effectiveness, and compatibility with a variety of communication systems. Additionally, its high reliability and durability make it an ideal choice for applications that require a long-term solution.
The original design intention of the XQR4036XL-3CB228M chip model was to provide a high-performance, energy-efficient, and cost-effective solution for a variety of applications. It is designed to be highly compatible with a variety of communication systems, making it suitable for a wide range of applications. Additionally, it is designed to be highly reliable and durable, making it an ideal choice for applications that require a long-term solution.
As for the possibility of future upgrades, the XQR4036XL-3CB228M chip model is designed to be highly upgradeable. This means that it can be upgraded with new features and technologies to meet the changing needs of the market. Additionally, it can be used in advanced communication systems, such as 5G networks, and is expected to remain a viable option for many applications in the future.
In terms of actual case studies and precautions, the XQR4036XL-3CB228M chip model has been used in a variety of applications, including consumer electronics, automotive, and industrial applications. Its high performance, energy efficiency, cost-effectiveness, and compatibility with a variety of communication systems make it an ideal choice for many applications. Additionally, its high reliability and durability make it an ideal choice for applications that require a long-term solution. However, it is important to note that the chip model should be used in accordance with the manufacturer's instructions in order to ensure proper operation.
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