AMD Xilinx
XQR4013XL-3CB228M
XQR4013XL-3CB228M ECAD Model
XQR4013XL-3CB228M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 1368 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | TYPICAL GATES = 10000 TO 30000 | |
| Clock Frequency-Max | 166 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-CQFP-F228 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Total Dose | 60k Rad(Si) V | |
| Number of Terminals | 228 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | TPAK228,2.5SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Width | 39.37 mm | |
| Length | 39.37 mm | |
| Seated Height-Max | 3.302 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | GQFF, TPAK228,2.5SQ,25 | |
| Pin Count | 228 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQR4013XL-3CB228M Datasheet Download
XQR4013XL-3CB228M Overview
The XQR4013XL-3CB228M chip model is a cutting-edge technology that has revolutionized the way we process data and communicate. It is a highly efficient and powerful chip model that offers a wide range of capabilities and features. It is designed to be used in a variety of applications, such as communication systems, networks, and intelligent scenarios.
One of the main advantages of the XQR4013XL-3CB228M chip model is its high efficiency. It is capable of processing data quickly and accurately, reducing latency and improving overall performance. It also has a low power consumption, which makes it suitable for a variety of applications. Additionally, it has a wide range of features that make it suitable for a variety of applications. These features include an integrated memory controller, high-speed data transfer, and advanced communication protocols.
The XQR4013XL-3CB228M chip model has been designed with future upgrades in mind. It can be easily upgraded to meet the needs of future applications, such as those that require advanced communication systems. Additionally, it has the potential to be used in the era of fully intelligent systems. It can be used in intelligent networks and scenarios, such as those that involve autonomous vehicles, smart homes, and intelligent factories.
The XQR4013XL-3CB228M chip model is expected to be in high demand in the future. With its advanced features and capabilities, it is expected to be used in a variety of applications and scenarios. Additionally, its low power consumption and efficient processing make it an attractive option for businesses and organizations looking for cost-effective solutions.
In conclusion, the XQR4013XL-3CB228M chip model is a cutting-edge technology that is designed to meet the needs of the future. It has a wide range of features and capabilities that make it suitable for a variety of applications and scenarios. Additionally, it has the potential to be used in the era of fully intelligent systems. As such, it is expected to be in high demand in the future, and it is likely to be used in a variety of applications and scenarios.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||