AMD Xilinx
XQR2V3000-4CG717V
XQR2V3000-4CG717V ECAD Model
XQR2V3000-4CG717V Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-CBGA-X717 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 717 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Equivalence Code | CGA717,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | CGA | |
| Package Description | 1.27 MM PITCH, CERAMIC, CGA-717 | |
| Pin Count | 717 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 9A515.E.2 | |
| HTS Code | 8542.39.00.01 |
XQR2V3000-4CG717V Datasheet Download
XQR2V3000-4CG717V Overview
The chip model XQR2V3000-4CG717V is a powerful, versatile integrated circuit (IC) designed for advanced communication systems. It is designed to enable a wide range of applications, from high-speed data transmission to low-power wireless communication. Its original design intention was to provide a reliable and efficient platform for the development of future communication systems.
The chip model XQR2V3000-4CG717V is capable of supporting a variety of communication protocols, including 5G, Wi-Fi, Bluetooth, and more. It is also able to provide support for advanced network security features, such as encryption and authentication. Additionally, it is capable of supporting a wide range of intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing.
The chip model XQR2V3000-4CG717V is also capable of being used in the era of fully intelligent systems. Its advanced features make it an ideal platform for the development and popularization of future intelligent robots. It can be used to create robots with advanced capabilities, such as autonomous navigation, object recognition, and natural language processing. Additionally, it is capable of supporting the development of robots that can interact with humans and perform complex tasks.
In order to effectively use the chip model XQR2V3000-4CG717V, a certain level of technical knowledge is required. This includes knowledge of programming languages, such as C++ and Python, as well as knowledge of circuit design and embedded systems. Additionally, knowledge of artificial intelligence, machine learning, and natural language processing is essential for the successful use of the model. With the right technical skills, the chip model XQR2V3000-4CG717V can be used to develop powerful, intelligent robots that can revolutionize the way we interact with the world.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||