AMD Xilinx
XQR2V3000-4CG717M
XQR2V3000-4CG717M ECAD Model
XQR2V3000-4CG717M Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 516 | |
| Number of Outputs | 516 | |
| Number of Logic Cells | 32256 | |
| Number of Equivalent Gates | 3000000 | |
| Number of CLBs | 3584 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3584 CLBS, 3000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-CBGA-X717 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 717 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Equivalence Code | CGA717,27X27,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | CGA | |
| Package Description | 1.27 MM PITCH, CERAMIC, CGA-717 | |
| Pin Count | 717 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 9A515.E.2 | |
| HTS Code | 8542.39.00.01 |
XQR2V3000-4CG717M Datasheet Download
XQR2V3000-4CG717M Overview
The XQR2V3000-4CG717M chip model is a powerful and versatile tool that can be used in a variety of industries. It is a high-performance, low-power, low-cost chip model that is perfect for next-generation applications. With its advanced features, the chip model can be used to power a wide range of applications, from industrial automation and robotics to medical devices and consumer electronics.
The XQR2V3000-4CG717M chip model is designed to provide high performance and low power consumption. It is capable of running large applications quickly and efficiently. The chip model also offers a wide range of features, such as advanced memory management and high-speed communication protocols. This makes it an ideal choice for applications that require high performance and low power consumption.
The XQR2V3000-4CG717M chip model is also well-suited for use in networks and intelligent scenarios. It can be used to power a wide range of intelligent systems, such as autonomous vehicles, smart homes, and artificial intelligence applications. The chip model is also capable of supporting a wide range of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee. This makes it an ideal choice for applications that require high performance and low power consumption.
The XQR2V3000-4CG717M chip model is also well-suited for use in the development and popularization of future intelligent robots. The chip model is capable of running large applications quickly and efficiently, and its advanced features make it an ideal choice for applications that require high performance and low power consumption. The chip model is also capable of supporting a wide range of communication protocols, such as Wi-Fi, Bluetooth, and Zigbee. This makes it an ideal choice for applications that require high performance and low power consumption.
In order to use the XQR2V3000-4CG717M chip model effectively, it is important to have a good understanding of its features and capabilities. Technical talents with knowledge of programming languages such as C and C++ are essential for using the chip model effectively. Additionally, knowledge of embedded systems and computer architecture is also needed in order to use the chip model effectively. With the right skills and knowledge, the XQR2V3000-4CG717M chip model can be used to create powerful and efficient intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||