XQ7Z045-1RF900Q
XQ7Z045-1RF900Q
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XQ7Z045-1RF900Q


XQ7Z045-1RF900Q
F20-XQ7Z045-1RF900Q
Active
CMOS, BGA-900
BGA-900

XQ7Z045-1RF900Q ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XQ7Z045-1RF900Q Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Surface Mount YES
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Power Supplies 1,1.8 V
Temperature Grade AUTOMOTIVE
UV Erasable N
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Seated Height-Max 3.44 mm
Width 31 mm
Length 31 mm
Ihs Manufacturer XILINX INC
Package Description BGA-900
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XQ7Z045-1RF900Q Datasheet Download


XQ7Z045-1RF900Q Overview



The XQ7Z045-1RF900Q chip model is an advanced chip model developed by a major semiconductor company. It has many advantages, such as low power consumption, high speed, and a wide range of applications. It is widely used in various industries and has become a popular choice for many electronic products.


The design intention of the XQ7Z045-1RF900Q chip model is to provide users with a reliable, high-performance, and cost-effective solution. It is designed to be compatible with a wide range of applications and supports a variety of communication protocols. The model is also designed to be flexible and upgradeable, allowing users to easily upgrade their systems in the future.


The XQ7Z045-1RF900Q chip model has a wide range of applications in the communication field, and its demand is expected to grow in the future. It can be used in advanced communication systems, such as 5G networks, and can also be used in the development and popularization of intelligent robots. To use the model effectively, technical talents with knowledge in communication protocols and programming are needed.


In conclusion, the XQ7Z045-1RF900Q chip model is a reliable and cost-effective solution for many industries. It has a wide range of applications, is easily upgradeable, and is expected to have a high demand in the future. It can be used in advanced communication systems and in the development and popularization of intelligent robots. Technical talents with knowledge in communication protocols and programming are needed to use the model effectively.



2,061 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote