XCKU040-L1FBVA900I
XCKU040-L1FBVA900I
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rohs

AMD Xilinx

XCKU040-L1FBVA900I


XCKU040-L1FBVA900I
F20-XCKU040-L1FBVA900I
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA-900
BGA-900

XCKU040-L1FBVA900I ECAD Model


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XCKU040-L1FBVA900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 520
Number of Outputs 520
Number of Logic Cells 530250
Number of CLBs 1920
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 1920 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 927 mV
Supply Voltage-Min 873 mV
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 31 mm
Length 31 mm
Seated Height-Max 2.8 mm
Ihs Manufacturer XILINX INC
Package Description BGA-900
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XCKU040-L1FBVA900I Datasheet Download


XCKU040-L1FBVA900I Overview



The XCKU040-L1FBVA900I chip model is a powerful and versatile tool for engineers looking to build high-performance digital signal processing, embedded processing, and image processing solutions. It is a Field Programmable Gate Array (FPGA) device that is programmed using a Hardware Description Language (HDL). This allows engineers to quickly and easily customize the chip to meet their needs.


The future development of the chip model XCKU040-L1FBVA900I and related industries will depend on the specific technologies that are needed. New technologies may be required to keep up with the demands of the application environment. For example, the use of artificial intelligence (AI) and machine learning (ML) algorithms may be necessary for certain tasks.


The XCKU040-L1FBVA900I chip model can be used in the development and popularization of future intelligent robots. This chip model is particularly well-suited for tasks that require high-speed data processing, such as computer vision. To use the model effectively, engineers will need to have a good understanding of HDL programming, as well as knowledge of AI and ML algorithms. Additionally, engineers will need to be familiar with the specific hardware components that are used in the development of the robot.


In conclusion, the XCKU040-L1FBVA900I chip model is a powerful tool for engineers looking to build high-performance digital signal processing, embedded processing, and image processing solutions. The future development of the chip model and related industries will depend on the specific technologies that are needed. Additionally, the chip model can be used in the development and popularization of future intelligent robots, but engineers will need to be familiar with HDL programming, AI and ML algorithms, and the specific hardware components that are used in the development of the robot.



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Unit Price: $1,667.88
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,551.1284 $1,551.1284
10+ $1,534.4496 $15,344.4960
100+ $1,451.0556 $145,105.5600
1000+ $1,367.6616 $683,830.8000
10000+ $1,250.9100 $1,250,910.0000
The price is for reference only, please refer to the actual quotation!

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