
AMD Xilinx
XCKU040-L1FBVA900I
XCKU040-L1FBVA900I ECAD Model
XCKU040-L1FBVA900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 520 | |
Number of Outputs | 520 | |
Number of Logic Cells | 530250 | |
Number of CLBs | 1920 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 1920 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 927 mV | |
Supply Voltage-Min | 873 mV | |
JESD-30 Code | S-PBGA-B900 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.8 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | BGA-900 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XCKU040-L1FBVA900I Datasheet Download
XCKU040-L1FBVA900I Overview
The XCKU040-L1FBVA900I chip model is a powerful and versatile tool for engineers looking to build high-performance digital signal processing, embedded processing, and image processing solutions. It is a Field Programmable Gate Array (FPGA) device that is programmed using a Hardware Description Language (HDL). This allows engineers to quickly and easily customize the chip to meet their needs.
The future development of the chip model XCKU040-L1FBVA900I and related industries will depend on the specific technologies that are needed. New technologies may be required to keep up with the demands of the application environment. For example, the use of artificial intelligence (AI) and machine learning (ML) algorithms may be necessary for certain tasks.
The XCKU040-L1FBVA900I chip model can be used in the development and popularization of future intelligent robots. This chip model is particularly well-suited for tasks that require high-speed data processing, such as computer vision. To use the model effectively, engineers will need to have a good understanding of HDL programming, as well as knowledge of AI and ML algorithms. Additionally, engineers will need to be familiar with the specific hardware components that are used in the development of the robot.
In conclusion, the XCKU040-L1FBVA900I chip model is a powerful tool for engineers looking to build high-performance digital signal processing, embedded processing, and image processing solutions. The future development of the chip model and related industries will depend on the specific technologies that are needed. Additionally, the chip model can be used in the development and popularization of future intelligent robots, but engineers will need to be familiar with HDL programming, AI and ML algorithms, and the specific hardware components that are used in the development of the robot.
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2,133 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,551.1284 | $1,551.1284 |
10+ | $1,534.4496 | $15,344.4960 |
100+ | $1,451.0556 | $145,105.5600 |
1000+ | $1,367.6616 | $683,830.8000 |
10000+ | $1,250.9100 | $1,250,910.0000 |
The price is for reference only, please refer to the actual quotation! |