AMD Xilinx
XQ5VLX30T-2FF323I
XQ5VLX30T-2FF323I ECAD Model
XQ5VLX30T-2FF323I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 30720 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 770 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.265 GHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B323 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 323 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA323,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-323 | |
| Pin Count | 323 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XQ5VLX30T-2FF323I Datasheet Download
XQ5VLX30T-2FF323I Overview
The chip model XQ5VLX30T-2FF323I is a product of the Xilinx Corporation, a leading provider of programmable logic solutions. This chip is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. It is a field-programmable gate array (FPGA) device with a Virtex-5 family architecture. This chip is suitable for applications that require high-speed processing, such as high-end networking and telecom systems.
The XQ5VLX30T-2FF323I is capable of supporting a wide range of technologies, including advanced communication systems, such as Ethernet, USB, and PCI Express. It is also capable of supporting the latest protocols, such as 10g Ethernet and PCIe Gen3. The chip also includes a number of features that make it suitable for high-speed applications, such as a high-performance memory controller and a high-speed interconnect fabric.
The XQ5VLX30T-2FF323I is designed to be highly scalable and can be used in a variety of applications. It is capable of supporting a wide range of technologies and protocols, making it an ideal solution for advanced communications systems. Furthermore, the chip is designed to be highly reliable and is capable of operating at high speeds without any problems.
When it comes to industry trends, the XQ5VLX30T-2FF323I is designed to be able to meet the needs of future applications. It is capable of supporting new technologies and protocols as they become available, allowing it to stay up-to-date with the latest advancements in the industry. Furthermore, the chip is designed to be highly reliable and is capable of operating at high speeds without any problems.
When it comes to the original design intention of the XQ5VLX30T-2FF323I, the chip was designed to be highly scalable and capable of supporting a wide range of technologies and protocols. It is also designed to be highly reliable and capable of operating at high speeds without any problems. Furthermore, the chip is designed to be able to meet the needs of future applications, allowing it to stay up-to-date with the latest advancements in the industry.
When it comes to product description and specific design requirements of the XQ5VLX30T-2FF323I, the chip is designed to be highly reliable and capable of operating at high speeds without any problems. It is also designed to be able to support a wide range of technologies and protocols, making it an ideal solution for advanced communications systems. Furthermore, the chip is designed to be able to meet the needs of future applications, allowing it to stay up-to-date with the latest advancements in the industry.
In terms of actual case studies and precautions, the XQ5VLX30T-2FF323I is designed to be highly reliable and capable of operating at high speeds without any problems. It is also designed to be able to support a wide range of technologies and protocols, making it an ideal solution for advanced communications systems. Furthermore, the chip is designed to be able to meet the needs of future applications, allowing it to stay up-to-date with the latest advancements in the industry.
In conclusion, the chip model XQ5VLX30T-2FF323I is a powerful and reliable chip that is designed to meet the needs of future applications. It is capable of supporting a wide range of technologies and protocols, making it an ideal solution for advanced communications systems. Furthermore, the chip is designed to be highly reliable and capable of operating at high speeds without any problems. With these features, the XQ5VLX30T-2FF323I is sure to be a great choice for any application that requires high-performance, low-power, and cost-effective solutions.
3,072 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
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| No reference price found. | ||