AMD Xilinx
XQ5VLX30T-1FF323I
XQ5VLX30T-1FF323I ECAD Model
XQ5VLX30T-1FF323I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 172 | |
| Number of Outputs | 172 | |
| Number of Logic Cells | 30720 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 900 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B323 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 323 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA323,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-323 | |
| Pin Count | 323 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XQ5VLX30T-1FF323I Datasheet Download
XQ5VLX30T-1FF323I Overview
The XQ5VLX30T-1FF323I chip model is a versatile, high-performance FPGA that offers a variety of features and capabilities to meet the needs of a wide range of applications. This chip model is designed to provide the highest level of performance and reliability, while also being cost-effective and energy-efficient. It is ideal for applications such as high-speed data processing, image processing, and communication systems.
The XQ5VLX30T-1FF323I chip model is designed to meet the demands of the most complex applications. It offers a variety of features and capabilities, including high-speed transceivers, high-speed memory interfaces, and high-speed I/O. It also features advanced power management features, allowing it to operate efficiently and reliably. Additionally, it is designed to be compatible with the latest technologies, making it suitable for use in a variety of advanced communication systems.
The XQ5VLX30T-1FF323I chip model is designed to be easily upgradable, allowing users to add new features and capabilities as their applications and needs evolve. This chip model supports a wide range of technologies, including high-speed transceivers, high-speed memory interfaces, and high-speed I/O. It is also designed to be compatible with the latest technologies, making it suitable for use in a variety of advanced communication systems.
In order to ensure the highest level of performance and reliability, it is important to understand the original design intention of the XQ5VLX30T-1FF323I chip model and the possible upgrades that may be available. Additionally, it is important to understand the product description and specific design requirements of the chip model, as well as any actual case studies and precautions that may be necessary.
As technology advances, the industry trends of the XQ5VLX30T-1FF323I chip model and the future development of related industries must be taken into account. It is important to determine what specific technologies are needed in order to meet the application environment’s requirements. By understanding the original design intention of the chip model and the possible upgrades that may be available, as well as the product description and specific design requirements, users can ensure that the XQ5VLX30T-1FF323I chip model is suitable for their needs.
4,721 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||