
AMD Xilinx
XQ4VSX55-10FF1148M
XQ4VSX55-10FF1148M ECAD Model
XQ4VSX55-10FF1148M Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 640 | |
Number of Outputs | 640 | |
Number of Logic Cells | 55296 | |
Number of CLBs | 6144 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6144 CLBS | |
Clock Frequency-Max | 1.028 GHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1148 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1148 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1148,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FCBGA-1148 | |
Pin Count | 1148 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ4VSX55-10FF1148M Datasheet Download
XQ4VSX55-10FF1148M Overview
The chip model XQ4VSX55-10FF1148M is a powerful and reliable semiconductor chip designed for high-performance digital signal processing, embedded processing, and image processing. This chip requires the use of HDL language, which makes it an ideal choice for a variety of applications.
The original design intention of the chip model XQ4VSX55-10FF1148M was to provide a powerful and reliable solution for a variety of applications. It is capable of handling a wide range of tasks, including high-performance digital signal processing, embedded processing, and image processing. It is also designed to be upgradable, allowing for future improvements and enhancements.
In terms of whether the chip model XQ4VSX55-10FF1148M can be applied to the development and popularization of future intelligent robots, the answer is yes. This chip has the potential to be used for a variety of tasks, including image processing, facial recognition, and motion control. However, it requires a certain level of technical expertise to use the chip effectively. Knowledge of HDL language and experience with embedded processing and digital signal processing are essential for successful application of the chip.
In conclusion, the chip model XQ4VSX55-10FF1148M is a powerful and reliable solution for a variety of applications. It is designed to be upgradable, allowing for future improvements and enhancements. It is capable of being used for the development and popularization of future intelligent robots, although it requires a certain level of technical expertise to use the chip effectively.
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