AMD Xilinx
XQ4VLX60-10FF1148M
XQ4VLX60-10FF1148M ECAD Model
XQ4VLX60-10FF1148M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 640 | |
| Number of Outputs | 640 | |
| Number of Logic Cells | 59904 | |
| Number of CLBs | 6656 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6656 CLBS | |
| Clock Frequency-Max | 1.028 GHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1148 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1148 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1148,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FCBGA-1148 | |
| Pin Count | 1148 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ4VLX60-10FF1148M Datasheet Download
XQ4VLX60-10FF1148M Overview
The XQ4VLX60-10FF1148M chip model is a cutting-edge technology solution that provides a range of advantages to its users. It is a high-performance, low-power, and flexible system-on-chip (SoC) design, which is suitable for use in a variety of applications. The model features a dual-core ARM Cortex-A9 processor, high-speed DDR3 memory, and advanced high-speed I/O, making it an ideal choice for a wide range of applications.
The XQ4VLX60-10FF1148M chip model is expected to be in high demand in the future, due to its ability to meet the needs of a variety of industries. It is suitable for use in consumer electronics, automotive, industrial, and medical applications, as well as for use in networked systems. It can be used in a variety of intelligent scenarios, such as machine learning, artificial intelligence, and robotic systems, and is expected to be a key component in the development of fully intelligent systems.
The product description of the XQ4VLX60-10FF1148M chip model includes a range of features, such as a dual-core ARM Cortex-A9 processor, high-speed DDR3 memory, and advanced high-speed I/O. The model has a wide range of applications and is suitable for use in a variety of industries. It is also designed to be highly flexible, allowing users to customize the design to suit their specific needs.
Case studies have shown that the XQ4VLX60-10FF1148M chip model is a reliable and efficient solution for a variety of applications. It has been used in a variety of intelligent scenarios, such as machine learning, artificial intelligence, and robotic systems. It is also suitable for use in networks, allowing users to connect multiple devices together.
When using the XQ4VLX60-10FF1148M chip model, it is important to ensure that the design meets the specific requirements of the application. It is also important to ensure that the chip is properly installed and configured, as any errors could lead to faulty operation. In addition, it is important to ensure that the chip is adequately cooled, as overheating can cause permanent damage.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||