XQ4085XL-1BG432N
XQ4085XL-1BG432N
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rohs

AMD Xilinx

XQ4085XL-1BG432N


XQ4085XL-1BG432N
F20-XQ4085XL-1BG432N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 40 X 40 MM, PLASTIC, MO-151BAU, BGA-432
40 X 40 MM, PLASTIC, MO-151BAU, BGA-432

XQ4085XL-1BG432N ECAD Model


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XQ4085XL-1BG432N Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Equivalent Gates 55000
Number of CLBs 3136
Combinatorial Delay of a CLB-Max 1.3 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-PRF-38535
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 3136 CLBS, 55000 GATES
Additional Feature TYPICAL GATES = 55000 TO 180000
Clock Frequency-Max 200 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 40 X 40 MM, PLASTIC, MO-151BAU, BGA-432
Pin Count 432
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XQ4085XL-1BG432N Datasheet Download


XQ4085XL-1BG432N Overview



The chip model XQ4085XL-1BG432N is a highly advanced, sophisticated piece of technology developed for use in a variety of industries. It is a high-performance, low-power, low-cost chip model that can be used in a wide range of applications. It is designed to help reduce costs and improve efficiency in a variety of industries.


The XQ4085XL-1BG432N chip model has a number of advantages over other chip models available on the market. It is designed to be extremely efficient, with low power consumption and high performance. It is also designed to be highly reliable, with a high-quality design and manufacturing process. The chip model is also designed to be highly customizable, allowing for a wide range of applications and uses.


In terms of future demand trends for the XQ4085XL-1BG432N chip model, it is expected that the demand for the chip model will continue to grow in the coming years. This is due to the increasing need for efficient, low-cost, high-performance chip models in a variety of industries. It is also likely that the chip model will be used in a number of new applications and industries in the future, as its capabilities continue to expand.


The original design intention of the XQ4085XL-1BG432N chip model was to provide a low-cost, high-performance chip model that could be used in a variety of applications. The chip model was designed to be highly customizable, allowing for a wide range of applications and uses. It is also designed to be highly reliable, with a high-quality design and manufacturing process.


In terms of future upgrades, the XQ4085XL-1BG432N chip model is expected to be able to be upgraded in the future. This is due to its highly customizable design and its ability to be used in a variety of applications. It is also likely that the chip model will be able to be used in more advanced communication systems in the future, as its capabilities continue to expand.


The XQ4085XL-1BG432N chip model is expected to have a number of potential applications in the future. It is likely that the chip model will be used in a number of networks in the future, as its capabilities and performance continue to improve. It is also likely that the chip model will be used in a number of intelligent scenarios, such as in the era of fully intelligent systems. The chip model is also likely to be used in a number of other applications, as its capabilities continue to expand.


Overall, the XQ4085XL-1BG432N chip model is a highly advanced, sophisticated piece of technology that is designed to provide a low-cost, high-performance chip model that can be used in a variety of applications. It is expected to have a number of advantages over other chip models available on the market, and its demand is expected to continue to grow in the coming years. The chip model is also expected to be able to be upgraded in the future, and it is likely to be used in a number of networks and intelligent scenarios in the future, as its capabilities continue to expand.



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