
AMD Xilinx
XQ4062XL-3BG432N
XQ4062XL-3BG432N ECAD Model
XQ4062XL-3BG432N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 352 | |
Number of Outputs | 352 | |
Number of Logic Cells | 5472 | |
Number of Equivalent Gates | 40000 | |
Number of CLBs | 2304 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-PRF-38535 | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2304 CLBS, 40000 GATES | |
Additional Feature | TYPICAL GATES = 40000 TO 130000 | |
Clock Frequency-Max | 166 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA432,31X31,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 40 X 40 MM, PLASTIC, MO-151BAU, BGA-432 | |
Pin Count | 432 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ4062XL-3BG432N Datasheet Download
XQ4062XL-3BG432N Overview
The chip model XQ4062XL-3BG432N is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is designed with the HDL language, which is a hardware description language used to describe the behavior of digital systems. This chip model is capable of performing complex operations quickly and efficiently, making it a perfect choice for applications that require high-performance digital signal processing.
The chip model XQ4062XL-3BG432N is designed to meet the needs of the current industry trends and can also be used in advanced communication systems. Its original design intention was to provide a powerful and reliable processor for embedded processing and image processing applications. Its potential for future upgrades is also promising, as it is capable of handling complex operations quickly and efficiently.
The application environment of the chip model XQ4062XL-3BG432N may require the support of new technologies, depending on the specific needs of the application. For example, if the application requires faster processing, then the chip model may need to be upgraded to accommodate the new technologies. In addition, if the application requires the support of a specific communication system, then the chip model may need to be upgraded to support the communication system.
In conclusion, the chip model XQ4062XL-3BG432N is a powerful and reliable processor for embedded processing, image processing, and other applications. It is designed with the HDL language, which is a hardware description language used to describe the behavior of digital systems. Its original design intention was to provide a powerful and reliable processor for embedded processing and image processing applications. Its potential for future upgrades is also promising, as it is capable of handling complex operations quickly and efficiently. The application environment of the chip model may require the support of new technologies, depending on the specific needs of the application. It is also capable of being used in advanced communication systems.
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