XQ4062XL-3BG432N
XQ4062XL-3BG432N
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rohs

AMD Xilinx

XQ4062XL-3BG432N


XQ4062XL-3BG432N
F20-XQ4062XL-3BG432N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 40 X 40 MM, PLASTIC, MO-151BAU, BGA-432
40 X 40 MM, PLASTIC, MO-151BAU, BGA-432

XQ4062XL-3BG432N ECAD Model


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XQ4062XL-3BG432N Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 352
Number of Outputs 352
Number of Logic Cells 5472
Number of Equivalent Gates 40000
Number of CLBs 2304
Combinatorial Delay of a CLB-Max 1.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-PRF-38535
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 2304 CLBS, 40000 GATES
Additional Feature TYPICAL GATES = 40000 TO 130000
Clock Frequency-Max 166 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA432,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 40 X 40 MM, PLASTIC, MO-151BAU, BGA-432
Pin Count 432
Reach Compliance Code not_compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XQ4062XL-3BG432N Datasheet Download


XQ4062XL-3BG432N Overview



The chip model XQ4062XL-3BG432N is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is designed with the HDL language, which is a hardware description language used to describe the behavior of digital systems. This chip model is capable of performing complex operations quickly and efficiently, making it a perfect choice for applications that require high-performance digital signal processing.


The chip model XQ4062XL-3BG432N is designed to meet the needs of the current industry trends and can also be used in advanced communication systems. Its original design intention was to provide a powerful and reliable processor for embedded processing and image processing applications. Its potential for future upgrades is also promising, as it is capable of handling complex operations quickly and efficiently.


The application environment of the chip model XQ4062XL-3BG432N may require the support of new technologies, depending on the specific needs of the application. For example, if the application requires faster processing, then the chip model may need to be upgraded to accommodate the new technologies. In addition, if the application requires the support of a specific communication system, then the chip model may need to be upgraded to support the communication system.


In conclusion, the chip model XQ4062XL-3BG432N is a powerful and reliable processor for embedded processing, image processing, and other applications. It is designed with the HDL language, which is a hardware description language used to describe the behavior of digital systems. Its original design intention was to provide a powerful and reliable processor for embedded processing and image processing applications. Its potential for future upgrades is also promising, as it is capable of handling complex operations quickly and efficiently. The application environment of the chip model may require the support of new technologies, depending on the specific needs of the application. It is also capable of being used in advanced communication systems.



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