
AMD Xilinx
XQ4062XL-3PG475M
XQ4062XL-3PG475M ECAD Model
XQ4062XL-3PG475M Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 352 | |
Number of Outputs | 352 | |
Number of Logic Cells | 5472 | |
Number of Equivalent Gates | 40000 | |
Number of CLBs | 2304 | |
Combinatorial Delay of a CLB-Max | 1.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Screening Level | MIL-PRF-38535 | |
Temperature Grade | MILITARY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2304 CLBS, 40000 GATES | |
Additional Feature | TYPICAL GATES = 40000 TO 130000 | |
Clock Frequency-Max | 166 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-CPGA-P475 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Number of Terminals | 475 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HIPGA | |
Package Equivalence Code | SPGA475,41X41 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH | |
Surface Mount | NO | |
Terminal Finish | MATTE TIN | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 54.864 mm | |
Length | 54.864 mm | |
Seated Height-Max | 5.969 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | HIPGA, SPGA475,41X41 | |
Pin Count | 475 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.39.00.01 |
XQ4062XL-3PG475M Datasheet Download
XQ4062XL-3PG475M Overview
The XQ4062XL-3PG475M chip model is a powerful and efficient digital signal processing (DSP) solution designed for embedded processing and image processing applications. It is a highly integrated chip that supports high-speed data processing, making it ideal for a variety of applications. The XQ4062XL-3PG475M is designed to be used with HDL (Hardware Description Language), a language designed to program digital logic circuits.
The XQ4062XL-3PG475M provides a comprehensive set of features that make it suitable for a wide range of applications. It includes a wide array of digital signal processing instructions and supports a variety of communication protocols, such as CAN, USB, and Ethernet. It also supports multiple memory configurations, including flash, SRAM, and ROM. The chip model also features a low-power mode and a wide operating temperature range, making it suitable for a variety of environments.
The XQ4062XL-3PG475M is an ideal solution for developing and deploying future intelligent robots. It is capable of performing complex tasks with ease, thanks to its powerful processing capabilities and wide range of features. To use the XQ4062XL-3PG475M effectively, it is important to have a strong understanding of HDL, as well as a good grasp of the fundamentals of embedded systems and robotics.
In order to ensure a successful implementation of the XQ4062XL-3PG475M, it is important to pay close attention to the product description and design requirements. It is also important to consider the specific needs of the application and to ensure that the chip model is compatible with the target platform. Additionally, it is important to be aware of any potential risks or hazards associated with the use of the chip model.
In conclusion, the XQ4062XL-3PG475M chip model is a powerful and efficient solution for embedded processing and image processing applications. It is an ideal choice for developing and deploying future intelligent robots, provided that the user has a strong understanding of HDL and the fundamentals of embedded systems and robotics. By paying close attention to the product description and design requirements, it is possible to ensure a successful implementation of the XQ4062XL-3PG475M.
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