XQ4062XL-3PG475M
XQ4062XL-3PG475M
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rohs

AMD Xilinx

XQ4062XL-3PG475M


XQ4062XL-3PG475M
F20-XQ4062XL-3PG475M
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, HIPGA, SPGA475,41X41
HIPGA, SPGA475,41X41

XQ4062XL-3PG475M ECAD Model


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XQ4062XL-3PG475M Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 352
Number of Outputs 352
Number of Logic Cells 5472
Number of Equivalent Gates 40000
Number of CLBs 2304
Combinatorial Delay of a CLB-Max 1.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Screening Level MIL-PRF-38535
Temperature Grade MILITARY
Package Shape SQUARE
Technology CMOS
Organization 2304 CLBS, 40000 GATES
Additional Feature TYPICAL GATES = 40000 TO 130000
Clock Frequency-Max 166 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-CPGA-P475
Qualification Status Not Qualified
JESD-609 Code e3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Number of Terminals 475
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HIPGA
Package Equivalence Code SPGA475,41X41
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
Surface Mount NO
Terminal Finish MATTE TIN
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 54.864 mm
Length 54.864 mm
Seated Height-Max 5.969 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description HIPGA, SPGA475,41X41
Pin Count 475
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01

XQ4062XL-3PG475M Datasheet Download


XQ4062XL-3PG475M Overview



The XQ4062XL-3PG475M chip model is a powerful and efficient digital signal processing (DSP) solution designed for embedded processing and image processing applications. It is a highly integrated chip that supports high-speed data processing, making it ideal for a variety of applications. The XQ4062XL-3PG475M is designed to be used with HDL (Hardware Description Language), a language designed to program digital logic circuits.


The XQ4062XL-3PG475M provides a comprehensive set of features that make it suitable for a wide range of applications. It includes a wide array of digital signal processing instructions and supports a variety of communication protocols, such as CAN, USB, and Ethernet. It also supports multiple memory configurations, including flash, SRAM, and ROM. The chip model also features a low-power mode and a wide operating temperature range, making it suitable for a variety of environments.


The XQ4062XL-3PG475M is an ideal solution for developing and deploying future intelligent robots. It is capable of performing complex tasks with ease, thanks to its powerful processing capabilities and wide range of features. To use the XQ4062XL-3PG475M effectively, it is important to have a strong understanding of HDL, as well as a good grasp of the fundamentals of embedded systems and robotics.


In order to ensure a successful implementation of the XQ4062XL-3PG475M, it is important to pay close attention to the product description and design requirements. It is also important to consider the specific needs of the application and to ensure that the chip model is compatible with the target platform. Additionally, it is important to be aware of any potential risks or hazards associated with the use of the chip model.


In conclusion, the XQ4062XL-3PG475M chip model is a powerful and efficient solution for embedded processing and image processing applications. It is an ideal choice for developing and deploying future intelligent robots, provided that the user has a strong understanding of HDL and the fundamentals of embedded systems and robotics. By paying close attention to the product description and design requirements, it is possible to ensure a successful implementation of the XQ4062XL-3PG475M.



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