XC4062XL-09PG475C
XC4062XL-09PG475C
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rohs

AMD Xilinx

XC4062XL-09PG475C


XC4062XL-09PG475C
F20-XC4062XL-09PG475C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, HIPGA, SPGA475,41X41
HIPGA, SPGA475,41X41

XC4062XL-09PG475C ECAD Model


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XC4062XL-09PG475C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 3.3 V
Number of Inputs 384
Number of Outputs 384
Number of Logic Cells 2304
Number of Equivalent Gates 40000
Number of CLBs 2304
Combinatorial Delay of a CLB-Max 1.2 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2304 CLBS, 40000 GATES
Additional Feature TYPICAL GATES = 40000-130000
Clock Frequency-Max 217 MHz
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-CPGA-P475
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 475
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HIPGA
Package Equivalence Code SPGA475,41X41
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH
Surface Mount NO
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 54.864 mm
Length 54.864 mm
Seated Height-Max 5.969 mm
Ihs Manufacturer XILINX INC
Package Description HIPGA, SPGA475,41X41
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC4062XL-09PG475C Datasheet Download


XC4062XL-09PG475C Overview



The XC4062XL-09PG475C chip model is a high-performance, low-power integrated circuit manufactured by Xilinx. It is designed to provide an efficient, reliable, and cost-effective solution for a wide range of applications. The XC4062XL-09PG475C chip model is suitable for use in advanced communication systems, intelligent robots, and other applications requiring high-performance and low-power consumption.


The XC4062XL-09PG475C chip model is a powerful and flexible integrated circuit that can be used to implement a variety of applications. It is designed with a low-power consumption architecture and can be used in a variety of operating conditions. The chip also features a wide range of connectivity options, including Ethernet, USB, and serial interfaces. It has a wide range of programmable logic and memory resources, making it suitable for applications requiring a high degree of flexibility.


The original design intention of the XC4062XL-09PG475C chip model was to provide a reliable, efficient, and cost-effective solution for a wide range of applications. Its design includes a wide range of programmable logic and memory resources, making it suitable for applications requiring a high degree of flexibility. The chip also features a low-power consumption architecture and can be used in a variety of operating conditions. It is designed to provide an efficient, reliable, and cost-effective solution for a wide range of applications.


The XC4062XL-09PG475C chip model is suitable for use in advanced communication systems, intelligent robots, and other applications requiring high-performance and low-power consumption. It has the potential for future upgrades, such as increased memory, expanded I/O capabilities, and enhanced performance. To use the chip model effectively, technical talents such as embedded system design engineers, software engineers, and hardware engineers are needed.


When using the XC4062XL-09PG475C chip model, it is important to take into account the specific design requirements of the application. For example, the chip model should be used in the appropriate operating conditions and the necessary resources should be allocated to the application. In addition, it is important to consider the power consumption of the chip model and the potential for future upgrades.


The XC4062XL-09PG475C chip model is a powerful and flexible integrated circuit that can be used to implement a variety of applications. It is suitable for use in advanced communication systems, intelligent robots, and other applications requiring high-performance and low-power consumption. With its wide range of programmable logic and memory resources, the chip model has the potential for future upgrades. To use the chip model effectively, technical talents such as embedded system design engineers, software engineers, and hardware engineers are needed. When using the chip model, it is important to take into account the specific design requirements of the application and the potential for future upgrades.



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Unit Price: $354.7368
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Pricing (USD)

QTY Unit Price Ext Price
1+ $329.9052 $329.9052
10+ $326.3579 $3,263.5786
100+ $308.6210 $30,862.1016
1000+ $290.8842 $145,442.0880
10000+ $266.0526 $266,052.6000
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