
AMD Xilinx
XC4062XL-09PG475C
XC4062XL-09PG475C ECAD Model
XC4062XL-09PG475C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 384 | |
Number of Outputs | 384 | |
Number of Logic Cells | 2304 | |
Number of Equivalent Gates | 40000 | |
Number of CLBs | 2304 | |
Combinatorial Delay of a CLB-Max | 1.2 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2304 CLBS, 40000 GATES | |
Additional Feature | TYPICAL GATES = 40000-130000 | |
Clock Frequency-Max | 217 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-CPGA-P475 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 475 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HIPGA | |
Package Equivalence Code | SPGA475,41X41 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH | |
Surface Mount | NO | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 54.864 mm | |
Length | 54.864 mm | |
Seated Height-Max | 5.969 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | HIPGA, SPGA475,41X41 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC4062XL-09PG475C Datasheet Download
XC4062XL-09PG475C Overview
The XC4062XL-09PG475C chip model is a high-performance, low-power integrated circuit manufactured by Xilinx. It is designed to provide an efficient, reliable, and cost-effective solution for a wide range of applications. The XC4062XL-09PG475C chip model is suitable for use in advanced communication systems, intelligent robots, and other applications requiring high-performance and low-power consumption.
The XC4062XL-09PG475C chip model is a powerful and flexible integrated circuit that can be used to implement a variety of applications. It is designed with a low-power consumption architecture and can be used in a variety of operating conditions. The chip also features a wide range of connectivity options, including Ethernet, USB, and serial interfaces. It has a wide range of programmable logic and memory resources, making it suitable for applications requiring a high degree of flexibility.
The original design intention of the XC4062XL-09PG475C chip model was to provide a reliable, efficient, and cost-effective solution for a wide range of applications. Its design includes a wide range of programmable logic and memory resources, making it suitable for applications requiring a high degree of flexibility. The chip also features a low-power consumption architecture and can be used in a variety of operating conditions. It is designed to provide an efficient, reliable, and cost-effective solution for a wide range of applications.
The XC4062XL-09PG475C chip model is suitable for use in advanced communication systems, intelligent robots, and other applications requiring high-performance and low-power consumption. It has the potential for future upgrades, such as increased memory, expanded I/O capabilities, and enhanced performance. To use the chip model effectively, technical talents such as embedded system design engineers, software engineers, and hardware engineers are needed.
When using the XC4062XL-09PG475C chip model, it is important to take into account the specific design requirements of the application. For example, the chip model should be used in the appropriate operating conditions and the necessary resources should be allocated to the application. In addition, it is important to consider the power consumption of the chip model and the potential for future upgrades.
The XC4062XL-09PG475C chip model is a powerful and flexible integrated circuit that can be used to implement a variety of applications. It is suitable for use in advanced communication systems, intelligent robots, and other applications requiring high-performance and low-power consumption. With its wide range of programmable logic and memory resources, the chip model has the potential for future upgrades. To use the chip model effectively, technical talents such as embedded system design engineers, software engineers, and hardware engineers are needed. When using the chip model, it is important to take into account the specific design requirements of the application and the potential for future upgrades.
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4,878 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $329.9052 | $329.9052 |
10+ | $326.3579 | $3,263.5786 |
100+ | $308.6210 | $30,862.1016 |
1000+ | $290.8842 | $145,442.0880 |
10000+ | $266.0526 | $266,052.6000 |
The price is for reference only, please refer to the actual quotation! |