AMD Xilinx
XQ4036XL-3CB228M
XQ4036XL-3CB228M ECAD Model
XQ4036XL-3CB228M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Additional Feature | TYPICAL GATES = 22000 TO 65000 | |
| JESD-609 Code | e0 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Length | 39.37 mm | |
| Width | 39.37 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| Part Package Code | QFP | |
| Package Description | TOP BRAZED, CERAMIC, MO-113AD, QFP-228 | |
| Pin Count | 228 | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 166 MHz | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| JESD-30 Code | S-CQFP-F228 | |
| Moisture Sensitivity Level | 1 | |
| Number of CLBs | 1296 | |
| Number of Equivalent Gates | 22000 | |
| Number of Terminals | 228 | |
| Organization | 1296 CLBS, 22000 GATES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38535 | |
| Seated Height-Max | 3.302 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Number of Inputs | 192 | |
| Number of Logic Cells | 3078 | |
| Number of Outputs | 192 | |
| Package Equivalence Code | TPAK228,2.5SQ,25 | |
| Power Supplies | 3.3 V |
XQ4036XL-3CB228M Datasheet Download
XQ4036XL-3CB228M Overview
The chip model XQ4036XL-3CB228M is a high-performance digital signal processor (DSP) designed to meet the needs of embedded processing, image processing, and other applications. It is ideal for applications that require the use of HDL language, as it offers a wide range of features and capabilities.
The XQ4036XL-3CB228M chip model has a number of advantages that make it an attractive choice for many applications. It has a high processing speed, low power consumption, and a wide range of peripheral interfaces. It also has a built-in cache memory, allowing for faster data processing. Additionally, the chip model offers a high degree of scalability, allowing it to be used for a variety of applications.
The demand for the XQ4036XL-3CB228M chip model is expected to continue to grow in the future, as more applications require the use of HDL language. As the need for high-performance digital signal processing increases, the chip model is likely to become even more popular. Additionally, as the technology advances, the chip model may be upgraded to provide more advanced features, such as support for advanced communication systems.
The original design intention of the XQ4036XL-3CB228M chip model was to provide a high-performance, low-power solution for embedded processing and image processing applications. It is designed to be scalable and upgradable, allowing it to be used for a wide range of applications. Additionally, the chip model is designed to be compatible with a variety of different HDL languages, making it an attractive choice for many applications.
The XQ4036XL-3CB228M chip model is a powerful and versatile solution for many applications. It has a wide range of features and capabilities, allowing it to be used for a variety of applications. Additionally, the chip model is designed to be upgradable, making it possible to use it for advanced communication systems in the future. With its high processing speed, low power consumption, and wide range of peripheral interfaces, the XQ4036XL-3CB228M chip model is an ideal solution for many applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||