AMD Xilinx
XQ4013XL-3CB228M
XQ4013XL-3CB228M ECAD Model
XQ4013XL-3CB228M Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 192 | |
| Number of Outputs | 192 | |
| Number of Logic Cells | 1368 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | MIL-PRF-38535 | |
| Temperature Grade | MILITARY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | TYPICAL GATES = 10000 TO 30000 | |
| Clock Frequency-Max | 166 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-CQFP-F228 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Number of Terminals | 228 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | GQFF | |
| Package Equivalence Code | TPAK228,2.5SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, GUARD RING | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | FLAT | |
| Terminal Pitch | 635 µm | |
| Terminal Position | QUAD | |
| Width | 39.37 mm | |
| Length | 39.37 mm | |
| Seated Height-Max | 3.302 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TOP BRAZED, CERAMIC, MO-113AD, QFP-228 | |
| Pin Count | 228 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 |
XQ4013XL-3CB228M Datasheet Download
XQ4013XL-3CB228M Overview
The XQ4013XL-3CB228M chip model is a cutting-edge piece of technology that is designed to be used in modern communication systems. It was developed with the intention of providing a reliable and efficient way to transmit data across networks. This chip model is capable of providing a high-speed connection with low latency, making it an ideal choice for those looking for a reliable solution for their communication needs.
The XQ4013XL-3CB228M chip model is also highly versatile and can be used in a variety of different applications. It is capable of being used in advanced communication systems, allowing for the transmission of data across a wide range of networks. It is also capable of being used in the development and popularization of future intelligent robots, as it is able to detect and respond to changes in the environment. This makes it a great choice for those looking to build and deploy intelligent robots.
The XQ4013XL-3CB228M chip model is capable of being used in the era of fully intelligent systems. It is able to detect and respond to changes in the environment, allowing it to be used in a variety of different scenarios. It is also capable of being used in the development and popularization of future intelligent robots, as it is able to detect and respond to changes in the environment. In order to use the model effectively, it is important to have the right technical talents. This includes knowledge of computer programming, as well as an understanding of the hardware and software components of the chip model.
In conclusion, the XQ4013XL-3CB228M chip model is a cutting-edge piece of technology that is designed to be used in modern communication systems. It is highly versatile and can be used in a variety of different applications, including advanced communication systems, the development and popularization of future intelligent robots, and the era of fully intelligent systems. In order to use the model effectively, it is important to have the right technical talents.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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