AMD Xilinx
XCZU9EG-L1FFVC900I
XCZU9EG-L1FFVC900I ECAD Model
XCZU9EG-L1FFVC900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU9EG-L1FFVC900I Datasheet Download
XCZU9EG-L1FFVC900I Overview
The XCZU9EG-L1FFVC900I chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. This chip model is capable of handling complex tasks and is highly reliable in performance. It is also designed to be used with HDL (hardware description language) for programming.
The XCZU9EG-L1FFVC900I chip model is designed to provide high performance, reliability, and scalability. It is equipped with a high-speed processor, a large memory, and a wide range of I/O options. It also has a flexible architecture that can be easily adapted to different application requirements. The chip model is also designed to be energy-efficient and cost-effective.
The XCZU9EG-L1FFVC900I chip model is suitable for applications such as digital signal processing, embedded processing, image processing, and more. It is expected that the demand for this chip model will continue to grow in the future as more applications require high-performance processing.
In order to use the XCZU9EG-L1FFVC900I chip model, designers must have a good understanding of the product description, design requirements, and actual case studies. Designers must also take into account the power consumption, operating temperature, and other factors when designing the chip. In addition, designers must also be aware of the potential risks associated with the chip model and take the necessary precautions to ensure safe and reliable operation.
In conclusion, the XCZU9EG-L1FFVC900I chip model is a powerful processor designed for high-performance digital signal processing, embedded processing, and image processing. It offers high performance, reliability, scalability, and cost-effectiveness. The demand for this chip model is expected to grow in the future as more applications require high-performance processing. Designers must have a good understanding of the product description, design requirements, and actual case studies in order to use the chip model safely and effectively.
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2,666 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,684.5581 | $1,684.5581 |
| 10+ | $1,666.4446 | $16,664.4458 |
| 100+ | $1,575.8769 | $157,587.6936 |
| 1000+ | $1,485.3093 | $742,654.6480 |
| 10000+ | $1,358.5146 | $1,358,514.6000 |
| The price is for reference only, please refer to the actual quotation! | ||