AMD Xilinx
XCZU9CG-2FFVC900I
XCZU9CG-2FFVC900I ECAD Model
XCZU9CG-2FFVC900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU9CG-2FFVC900I Datasheet Download
XCZU9CG-2FFVC900I Overview
The XCZU9CG-2FFVC900I chip model is a high-performance chip model designed for digital signal processing, embedded processing, and image processing. It requires the use of the HDL language, which is a hardware description language used to model, simulate, and implement digital systems. This chip model provides a great deal of flexibility and performance for a variety of applications.
The XCZU9CG-2FFVC900I chip model is a great choice for high-performance applications. It is designed to be energy efficient and has a low power consumption. The chip model is also designed with a high-speed memory interface that allows for faster data transfer and processing. Additionally, it supports multiple cores, allowing for more efficient and faster processing of data.
In terms of industry trends, the XCZU9CG-2FFVC900I chip model is expected to be in high demand in the future. With the increasing demand for high-performance applications, the chip model is a great choice for many applications. Additionally, the chip model is designed to be compatible with the latest technologies, making it a great choice for applications that require the support of new technologies.
The advantages of the XCZU9CG-2FFVC900I chip model are numerous. It is a powerful and efficient chip model that is designed for high-performance applications. It is energy efficient and has a low power consumption. It also supports multiple cores, allowing for faster and more efficient processing of data. Additionally, it is designed to be compatible with the latest technologies, making it a great choice for applications that require the support of new technologies.
In conclusion, the XCZU9CG-2FFVC900I chip model is a great choice for high-performance applications. It is designed to be energy efficient and has a low power consumption. Additionally, it supports multiple cores, allowing for faster and more efficient processing of data. It is also designed to be compatible with the latest technologies, making it a great choice for applications that require the support of new technologies. The chip model is expected to be in high demand in the future, as the demand for high-performance applications continues to increase.
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2,734 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,635.5456 | $2,635.5456 |
| 10+ | $2,607.2064 | $26,072.0640 |
| 100+ | $2,465.5104 | $246,551.0400 |
| 1000+ | $2,323.8144 | $1,161,907.2000 |
| 10000+ | $2,125.4400 | $2,125,440.0000 |
| The price is for reference only, please refer to the actual quotation! | ||