AMD Xilinx
XCZU6EG-L1FFVC900I
XCZU6EG-L1FFVC900I ECAD Model
XCZU6EG-L1FFVC900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU6EG-L1FFVC900I Datasheet Download
XCZU6EG-L1FFVC900I Overview
The chip model XCZU6EG-L1FFVC900I is a cutting-edge technology in the semiconductor industry, and its application range is wide. It is not only widely used in the fields of artificial intelligence, 5G communication, and autonomous driving, but also can be used in the development of other related industries. In terms of its advantages, XCZU6EG-L1FFVC900I has a powerful computing performance and a low power consumption, which can reduce the cost of product development. In addition, its small size and light weight make it easier to install and maintain.
In the future, the demand for XCZU6EG-L1FFVC900I will continue to increase in related industries. With the development of artificial intelligence, 5G communication, and autonomous driving, the chip model will be used in more and more fields. With the rapid development of these fields, the demand for XCZU6EG-L1FFVC900I will continue to increase.
As for the application of XCZU6EG-L1FFVC900I in the development and popularization of future intelligent robots, the chip model has the potential to be applied. The chip model has a powerful computing performance and a low power consumption, which can provide the necessary support for the development of intelligent robots. However, in order to use the chip model effectively, some technical talents are needed. For example, software engineers, hardware engineers, and system engineers are all necessary for the successful application of the chip model.
In conclusion, the chip model XCZU6EG-L1FFVC900I has great potential in the related industries. Its powerful computing performance and low power consumption make it an ideal choice for the development and popularization of future intelligent robots. However, in order to use the chip model effectively, it is necessary to have some technical talents.
You May Also Be Interested In
3,194 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,030.6513 | $2,030.6513 |
| 10+ | $2,008.8163 | $20,088.1632 |
| 100+ | $1,899.6415 | $189,964.1520 |
| 1000+ | $1,790.4667 | $895,233.3600 |
| 10000+ | $1,637.6220 | $1,637,622.0000 |
| The price is for reference only, please refer to the actual quotation! | ||