
AMD Xilinx
XCZU6CG-L1FFVC900I
XCZU6CG-L1FFVC900I ECAD Model
XCZU6CG-L1FFVC900I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B900 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-900 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU6CG-L1FFVC900I Datasheet Download
XCZU6CG-L1FFVC900I Overview
The XCZU6CG-L1FFVC900I chip model is a powerful and versatile device developed by Xilinx Inc., a leading provider of programmable logic devices. This model is designed to meet the needs of a variety of applications, including industrial automation, embedded systems, and medical devices. Its features include a high-performance, low-power FPGA fabric, a multi-gigabit transceiver, and a wide range of memory options.
The XCZU6CG-L1FFVC900I chip model offers many advantages over other chip models. It is a low-cost, low-power device that can be used to develop a wide range of applications. It is also highly efficient and has a high level of integration, which means that it can be used to reduce the size and complexity of products. Furthermore, the XCZU6CG-L1FFVC900I chip model can be used to develop applications with higher performance and lower power consumption.
The demand for the XCZU6CG-L1FFVC900I chip model is expected to increase in the future, as it is becoming increasingly important for industrial automation, embedded systems, and medical devices. This is due to its high performance, low-power consumption, and low cost. Furthermore, the XCZU6CG-L1FFVC900I chip model can be used to develop applications that are more reliable and efficient, which is becoming increasingly important in the modern world.
When using the XCZU6CG-L1FFVC900I chip model, it is important to understand the product description and specific design requirements. It is also important to consider the actual case studies and precautions when using the model. This is because the model can be used to develop applications that have higher performance and lower power consumption, but it is also important to ensure that the applications are reliable and efficient.
The XCZU6CG-L1FFVC900I chip model can be used in the development and popularization of future intelligent robots. This is because the model is highly efficient and has a high level of integration, which makes it suitable for robotics applications. Furthermore, the model can be used to develop applications that are more reliable and efficient, which is becoming increasingly important in the modern world. To use the model effectively, it is important to have technical talents with experience in programmable logic devices, embedded systems, and robotics.
You May Also Be Interested In
4,484 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,876.9111 | $1,876.9111 |
10+ | $1,856.7293 | $18,567.2928 |
100+ | $1,755.8201 | $175,582.0080 |
1000+ | $1,654.9109 | $827,455.4400 |
10000+ | $1,513.6380 | $1,513,638.0000 |
The price is for reference only, please refer to the actual quotation! |