XCZU6CG-L1FFVC900I
XCZU6CG-L1FFVC900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU6CG-L1FFVC900I


XCZU6CG-L1FFVC900I
F20-XCZU6CG-L1FFVC900I
Active
CMOS, FCBGA-900
FCBGA-900

XCZU6CG-L1FFVC900I ECAD Model


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XCZU6CG-L1FFVC900I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B900
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-900
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU6CG-L1FFVC900I Datasheet Download


XCZU6CG-L1FFVC900I Overview



The XCZU6CG-L1FFVC900I chip model is a powerful and versatile device developed by Xilinx Inc., a leading provider of programmable logic devices. This model is designed to meet the needs of a variety of applications, including industrial automation, embedded systems, and medical devices. Its features include a high-performance, low-power FPGA fabric, a multi-gigabit transceiver, and a wide range of memory options.


The XCZU6CG-L1FFVC900I chip model offers many advantages over other chip models. It is a low-cost, low-power device that can be used to develop a wide range of applications. It is also highly efficient and has a high level of integration, which means that it can be used to reduce the size and complexity of products. Furthermore, the XCZU6CG-L1FFVC900I chip model can be used to develop applications with higher performance and lower power consumption.


The demand for the XCZU6CG-L1FFVC900I chip model is expected to increase in the future, as it is becoming increasingly important for industrial automation, embedded systems, and medical devices. This is due to its high performance, low-power consumption, and low cost. Furthermore, the XCZU6CG-L1FFVC900I chip model can be used to develop applications that are more reliable and efficient, which is becoming increasingly important in the modern world.


When using the XCZU6CG-L1FFVC900I chip model, it is important to understand the product description and specific design requirements. It is also important to consider the actual case studies and precautions when using the model. This is because the model can be used to develop applications that have higher performance and lower power consumption, but it is also important to ensure that the applications are reliable and efficient.


The XCZU6CG-L1FFVC900I chip model can be used in the development and popularization of future intelligent robots. This is because the model is highly efficient and has a high level of integration, which makes it suitable for robotics applications. Furthermore, the model can be used to develop applications that are more reliable and efficient, which is becoming increasingly important in the modern world. To use the model effectively, it is important to have technical talents with experience in programmable logic devices, embedded systems, and robotics.



4,484 In Stock


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Unit Price: $2,018.184
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,876.9111 $1,876.9111
10+ $1,856.7293 $18,567.2928
100+ $1,755.8201 $175,582.0080
1000+ $1,654.9109 $827,455.4400
10000+ $1,513.6380 $1,513,638.0000
The price is for reference only, please refer to the actual quotation!

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