AMD Xilinx
XCZU6CG-2FFVC900I
XCZU6CG-2FFVC900I ECAD Model
XCZU6CG-2FFVC900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU6CG-2FFVC900I Datasheet Download
XCZU6CG-2FFVC900I Overview
XCZU6CG-2FFVC900I is a chip model designed by Xilinx, a leader in the field of programmable logic devices. It is a high-performance, low-power, high-reliability, and cost-effective solution for various applications. Its original design intention is to meet the demands of the industry for high-speed, low-power, and low-cost solutions.
The XCZU6CG-2FFVC900I chip model has a number of advantages. Firstly, it has a high-speed computing capability and can support up to 400 MHz of processing power. Secondly, it has a low power consumption, which makes it suitable for a wide range of applications. Thirdly, it has high reliability, which ensures that it can be used in various applications with confidence. Fourthly, it has a low cost, which makes it an attractive solution for many applications.
The XCZU6CG-2FFVC900I chip model is expected to be in high demand in the future, as it can be used in a variety of applications. It can be used in communication systems, such as 5G and beyond, as well as in networks and intelligent scenarios. It can also be used in the era of fully intelligent systems, as it is capable of supporting the high-speed computing needs of such systems.
The XCZU6CG-2FFVC900I chip model can be upgraded in the future to meet the ever-changing demands of the industry. It can be used in advanced communication systems, such as 5G and beyond, as well as in networks and intelligent scenarios. It can also be used in the era of fully intelligent systems, as it is capable of supporting the high-speed computing needs of such systems.
In conclusion, the XCZU6CG-2FFVC900I chip model is a reliable and cost-effective solution for various applications. It has a number of advantages, such as high-speed computing capability, low power consumption, high reliability, and low cost. It is expected to be in high demand in the future, as it can be used in a variety of applications, including communication systems, networks, and intelligent scenarios. It can also be upgraded in the future to meet the ever-changing demands of the industry and can be used in the era of fully intelligent systems.
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1,958 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $230.1305 | $230.1305 |
| 10+ | $227.6560 | $2,276.5602 |
| 100+ | $215.2834 | $21,528.3414 |
| 1000+ | $202.9108 | $101,455.4020 |
| 10000+ | $185.5892 | $185,589.1500 |
| The price is for reference only, please refer to the actual quotation! | ||