AMD Xilinx
XCZU5EG-L2FBVB900E
XCZU5EG-L2FBVB900E ECAD Model
XCZU5EG-L2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU5EG-L2FBVB900E Datasheet Download
XCZU5EG-L2FBVB900E Overview
The XCZU5EG-L2FBVB900E is a chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. This model requires the use of HDL language and is designed to provide users with the capability to meet their needs.
The industry trends of the chip model XCZU5EG-L2FBVB900E and the future development of related industries depend on the specific technologies needed for the application environment. This chip model was originally designed with the intention of providing users with the capability to meet their needs and to be able to be upgraded in the future. With its advanced features, the XCZU5EG-L2FBVB900E can be applied to advanced communication systems.
The XCZU5EG-L2FBVB900E is designed to meet the needs of users in terms of performance and flexibility. It has the capability to be upgraded with new technologies and features in order to keep up with the ever-evolving industry trends. With its advanced features, the XCZU5EG-L2FBVB900E can be applied to a variety of communication systems and applications.
The XCZU5EG-L2FBVB900E is designed to be able to handle a wide range of applications, from digital signal processing to image processing. Its features are designed to provide users with the capability to meet their needs. With its advanced features, the XCZU5EG-L2FBVB900E can be applied to a variety of communication systems and applications.
The XCZU5EG-L2FBVB900E is a high-performance chip model that is designed to meet the needs of users in terms of performance and flexibility. It is designed to be able to handle a wide range of applications, from digital signal processing to image processing. Its features are designed to provide users with the capability to meet their needs and to be able to be upgraded in the future. With its advanced features, the XCZU5EG-L2FBVB900E can be applied to advanced communication systems.
The XCZU5EG-L2FBVB900E is a chip model that is designed to meet the needs of users in terms of performance and flexibility and to be able to be upgraded in the future. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. This model requires the use of HDL language and is designed to provide users with the capability to meet their needs. With its advanced features, the XCZU5EG-L2FBVB900E can be applied to a variety of communication systems and applications.
In conclusion, the XCZU5EG-L2FBVB900E is a high-performance chip model that is designed to meet the needs of users in terms of performance and flexibility. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. This model requires the use of HDL language and is designed to provide users with the capability to meet their needs and to be able to be upgraded in the future. With its advanced features, the XCZU5EG-L2FBVB900E can be applied to a variety of communication systems and applications.
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3,625 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,074.5770 | $2,074.5770 |
| 10+ | $2,052.2698 | $20,522.6976 |
| 100+ | $1,940.7334 | $194,073.3360 |
| 1000+ | $1,829.1970 | $914,598.4800 |
| 10000+ | $1,673.0460 | $1,673,046.0000 |
| The price is for reference only, please refer to the actual quotation! | ||