AMD Xilinx
XCZU5EG-L1FBVB900I
XCZU5EG-L1FBVB900I ECAD Model
XCZU5EG-L1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 2.88 mm | |
| Width | 31 mm | |
| Length | 31 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU5EG-L1FBVB900I Datasheet Download
XCZU5EG-L1FBVB900I Overview
The chip model XCZU5EG-L1FBVB900I is a high-performance digital signal processor (DSP) designed for embedded processing, image processing, and other applications. It is designed to use the HDL language, a hardware description language, to program the chip and enable it to run complex algorithms and operations.
The XCZU5EG-L1FBVB900I chip is a great example of the industry’s move towards more powerful and efficient digital signal processing. This chip is capable of handling complex operations and algorithms, while also being efficient in its use of power. As such, it is a great choice for applications that require high-performance digital signal processing.
In terms of the future development of related industries and the potential for the XCZU5EG-L1FBVB900I chip to be used in advanced communication systems, it is likely that new technologies will be needed to support these applications. The original design intention of the chip was to enable complex operations and algorithms to be performed efficiently and quickly, so it is possible that the chip could be upgraded to support more advanced communication systems in the future.
Overall, the XCZU5EG-L1FBVB900I chip is a great example of the industry’s move towards more powerful and efficient digital signal processing. It is designed to be used in embedded processing, image processing, and other applications, and is capable of handling complex operations and algorithms. The chip is also likely to be upgradeable in the future, enabling it to be used in more advanced communication systems. As such, the XCZU5EG-L1FBVB900I chip is a great choice for applications that require high-performance digital signal processing.
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1,014 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,815.5981 | $1,815.5981 |
| 10+ | $1,796.0755 | $17,960.7552 |
| 100+ | $1,698.4627 | $169,846.2720 |
| 1000+ | $1,600.8499 | $800,424.9600 |
| 10000+ | $1,464.1920 | $1,464,192.0000 |
| The price is for reference only, please refer to the actual quotation! | ||