AMD Xilinx
XCZU4EG-L2FBVB900E
XCZU4EG-L2FBVB900E ECAD Model
XCZU4EG-L2FBVB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 110 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU4EG-L2FBVB900E Datasheet Download
XCZU4EG-L2FBVB900E Overview
The XCZU4EG-L2FBVB900E chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a high-level programming language used for designing and testing digital integrated circuits. This chip model is designed to handle complex computing tasks in a highly efficient manner, making it an ideal choice for various applications.
The industry trends of the chip model XCZU4EG-L2FBVB900E and the future development of related industries depend on the specific technologies needed. The original design intention of this chip model was to provide a powerful and efficient platform for signal processing, embedded processing, and image processing. It is highly likely that the chip model will be able to be upgraded in the future to support advanced communication systems.
The XCZU4EG-L2FBVB900E chip model is a great example of the power of modern technology. It is designed to provide a powerful platform for digital signal processing, embedded processing, and image processing. It is also designed to be able to upgrade in the future to support advanced communication systems. This chip model is a great tool for those looking to create powerful and efficient applications.
The XCZU4EG-L2FBVB900E chip model is a great example of the power of modern technology. It is designed to provide a powerful platform for digital signal processing, embedded processing, and image processing. It is also designed to be able to upgrade in the future to support advanced communication systems. This chip model is a great tool for those looking to create powerful and efficient applications. Furthermore, the use of HDL language ensures that the code written for the chip model is optimized for the highest possible performance.
The XCZU4EG-L2FBVB900E chip model is a great example of modern technology and its potential for powerful and efficient applications. It is designed to provide a powerful platform for digital signal processing, embedded processing, and image processing. It is also designed to be able to upgrade in the future to support advanced communication systems. The use of HDL language ensures that the code written for the chip model is optimized for the highest possible performance. With the potential for future upgrades, this chip model is a great tool for those looking to create powerful and efficient applications.
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2,481 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,431.4560 | $1,431.4560 |
| 10+ | $1,416.0640 | $14,160.6400 |
| 100+ | $1,339.1040 | $133,910.4000 |
| 1000+ | $1,262.1440 | $631,072.0000 |
| 10000+ | $1,154.4000 | $1,154,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||