AMD Xilinx
XCZU4EG-L1FBVB900I
XCZU4EG-L1FBVB900I ECAD Model
XCZU4EG-L1FBVB900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 720 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
| Supply Voltage-Max | 742 mV | |
| Supply Voltage-Min | 698 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FCBGA-900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU4EG-L1FBVB900I Datasheet Download
XCZU4EG-L1FBVB900I Overview
The Xilinx Zynq UltraScale+ MPSoC ZU4EG-L1FBVB900I is an integrated circuit designed for embedded systems and applications. It features an Arm Cortex-A53 quad-core processor, a Mali-400 MP2 GPU, and a H.264/H.265 video codec. The chip model is designed to meet the requirements of high-performance embedded applications and provides a comprehensive set of features and peripherals.
The Xilinx Zynq UltraScale+ MPSoC ZU4EG-L1FBVB900I offers a variety of benefits to users. It provides a high-performance, low-power, and cost-effective solution for embedded systems. It is also highly scalable and can be used in a variety of applications. It supports the latest technologies, such as DDR4 memory, PCIe Gen4, and USB 3.1. Furthermore, the chip model is equipped with a variety of peripherals, such as Ethernet, UART, I2C, and SPI, making it suitable for a wide range of applications.
The Xilinx Zynq UltraScale+ MPSoC ZU4EG-L1FBVB900I is expected to be in high demand in the future. The chip model is designed to meet the requirements of high-performance embedded applications and provides a comprehensive set of features and peripherals. Its scalability, low power consumption, and cost-effectiveness make it an attractive option for both existing and new applications.
In addition, the Xilinx Zynq UltraScale+ MPSoC ZU4EG-L1FBVB900I has been designed with specific design requirements in mind. The chip model is designed to meet the requirements of high-performance embedded applications and provides a comprehensive set of features and peripherals. It also supports the latest technologies, such as DDR4 memory, PCIe Gen4, and USB 3.1. Furthermore, the chip model is equipped with a variety of peripherals, such as Ethernet, UART, I2C, and SPI, making it suitable for a wide range of applications.
The Xilinx Zynq UltraScale+ MPSoC ZU4EG-L1FBVB900I is a versatile and powerful chip model that can be used in a variety of applications. It is expected to be in high demand in the future due to its scalability, low power consumption, and cost-effectiveness. Whether the application environment requires the support of new technologies depends on the specific requirements of the application. In any case, the Xilinx Zynq UltraScale+ MPSoC ZU4EG-L1FBVB900I is an excellent choice for embedded systems and applications.
You May Also Be Interested In
3,071 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,252.5240 | $1,252.5240 |
| 10+ | $1,239.0560 | $12,390.5600 |
| 100+ | $1,171.7160 | $117,171.6000 |
| 1000+ | $1,104.3760 | $552,188.0000 |
| 10000+ | $1,010.1000 | $1,010,100.0000 |
| The price is for reference only, please refer to the actual quotation! | ||