XCZU3EG-L1SFVA625I
XCZU3EG-L1SFVA625I
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rohs

AMD Xilinx

XCZU3EG-L1SFVA625I


XCZU3EG-L1SFVA625I
F20-XCZU3EG-L1SFVA625I
Active
CMOS, FCBGA-625
FCBGA-625

XCZU3EG-L1SFVA625I ECAD Model


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XCZU3EG-L1SFVA625I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 720 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
Supply Voltage-Max 742 mV
Supply Voltage-Min 698 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B625
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 625
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-625
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU3EG-L1SFVA625I Datasheet Download


XCZU3EG-L1SFVA625I Overview



The chip model XCZU3EG-L1SFVA625I is a highly advanced product of the semiconductor industry, and it is designed to provide a strong support for today's communication systems. It is a powerful and reliable chip model that is capable of handling a wide range of tasks in the communication field. With its powerful performance, it can easily meet the requirements of today's communication systems.


The industry trends of the chip model XCZU3EG-L1SFVA625I are constantly changing. With the rapid development of technology, the chip model is always evolving to meet the needs of the industry. For example, it is now possible to use the chip model in advanced communication systems, such as 5G and 6G networks, which require high-speed data transmission and processing capabilities.


In terms of the future development of the chip model, it is expected that it will be able to support more advanced technologies in the future. For example, it is possible that the chip model will be able to support new technologies such as artificial intelligence, machine learning, and big data analytics. This will enable the chip model to be used in more advanced applications, such as intelligent networks and intelligent systems.


The chip model XCZU3EG-L1SFVA625I is also capable of being used in the era of fully intelligent systems. It is expected that the chip model will be able to support the latest technologies in the field, such as autonomous driving, facial recognition, and natural language processing. This will enable the chip model to be used in more sophisticated applications, such as smart home systems and smart city networks.


Overall, the chip model XCZU3EG-L1SFVA625I is a powerful and reliable chip model that is capable of handling a wide range of tasks in the communication field. With its powerful performance and its ability to support advanced technologies, it is expected that the chip model will continue to be used in many more advanced applications in the future.



2,200 In Stock


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Unit Price: $2,327.9485
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,164.9921 $2,164.9921
10+ $2,141.7126 $21,417.1262
100+ $2,025.3152 $202,531.5195
1000+ $1,908.9178 $954,458.8850
10000+ $1,745.9614 $1,745,961.3750
The price is for reference only, please refer to the actual quotation!

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