
AMD Xilinx
XCZU3EG-L1SFVA625I
XCZU3EG-L1SFVA625I ECAD Model
XCZU3EG-L1SFVA625I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 720 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | |
Supply Voltage-Max | 742 mV | |
Supply Voltage-Min | 698 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B625 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 625 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-625 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU3EG-L1SFVA625I Datasheet Download
XCZU3EG-L1SFVA625I Overview
The chip model XCZU3EG-L1SFVA625I is a highly advanced product of the semiconductor industry, and it is designed to provide a strong support for today's communication systems. It is a powerful and reliable chip model that is capable of handling a wide range of tasks in the communication field. With its powerful performance, it can easily meet the requirements of today's communication systems.
The industry trends of the chip model XCZU3EG-L1SFVA625I are constantly changing. With the rapid development of technology, the chip model is always evolving to meet the needs of the industry. For example, it is now possible to use the chip model in advanced communication systems, such as 5G and 6G networks, which require high-speed data transmission and processing capabilities.
In terms of the future development of the chip model, it is expected that it will be able to support more advanced technologies in the future. For example, it is possible that the chip model will be able to support new technologies such as artificial intelligence, machine learning, and big data analytics. This will enable the chip model to be used in more advanced applications, such as intelligent networks and intelligent systems.
The chip model XCZU3EG-L1SFVA625I is also capable of being used in the era of fully intelligent systems. It is expected that the chip model will be able to support the latest technologies in the field, such as autonomous driving, facial recognition, and natural language processing. This will enable the chip model to be used in more sophisticated applications, such as smart home systems and smart city networks.
Overall, the chip model XCZU3EG-L1SFVA625I is a powerful and reliable chip model that is capable of handling a wide range of tasks in the communication field. With its powerful performance and its ability to support advanced technologies, it is expected that the chip model will continue to be used in many more advanced applications in the future.
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2,200 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,164.9921 | $2,164.9921 |
10+ | $2,141.7126 | $21,417.1262 |
100+ | $2,025.3152 | $202,531.5195 |
1000+ | $1,908.9178 | $954,458.8850 |
10000+ | $1,745.9614 | $1,745,961.3750 |
The price is for reference only, please refer to the actual quotation! |