XCZU3EG-2SFVA625I
XCZU3EG-2SFVA625I
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rohs

AMD Xilinx

XCZU3EG-2SFVA625I


XCZU3EG-2SFVA625I
F20-XCZU3EG-2SFVA625I
Active
CMOS, FCBGA-625
FCBGA-625

XCZU3EG-2SFVA625I ECAD Model


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XCZU3EG-2SFVA625I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B625
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 625
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description FCBGA-625
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU3EG-2SFVA625I Datasheet Download


XCZU3EG-2SFVA625I Overview



The XCZU3EG-2SFVA625I chip model is a powerful and versatile semiconductor device that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, which is an important tool for engineers and scientists to design, develop, and verify semiconductor devices.


The XCZU3EG-2SFVA625I chip model has the potential to revolutionize the way we think about embedded processing, image processing, and other applications. As technology advances, the XCZU3EG-2SFVA625I chip model can be used in a variety of new and exciting ways. For example, it can be used to power networks and intelligent systems, such as self-driving cars, autonomous drones, and smart homes.


The XCZU3EG-2SFVA625I chip model can also be used in the era of fully intelligent systems. In this era, the XCZU3EG-2SFVA625I chip model can be used to develop systems that are capable of learning and adapting to their environment. This could include artificial intelligence systems that are capable of making decisions, learning from experience, and responding to their environment.


In order to make the most of the XCZU3EG-2SFVA625I chip model, it is important to understand the industry trends and the future development of related industries. As technology advances, new technologies may be needed to support the XCZU3EG-2SFVA625I chip model in its application environment. This could include the development of more efficient algorithms, the integration of new sensors, and the use of new materials.


Overall, the XCZU3EG-2SFVA625I chip model is a powerful and versatile semiconductor device that has the potential to revolutionize the way we think about embedded processing, image processing, and other applications. With the right technologies and industry trends, the XCZU3EG-2SFVA625I chip model can be used to power networks and intelligent systems, as well as to develop fully intelligent systems in the future.



5,074 In Stock


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Unit Price: $542.88
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $504.8784 $504.8784
10+ $499.4496 $4,994.4960
100+ $472.3056 $47,230.5600
1000+ $445.1616 $222,580.8000
10000+ $407.1600 $407,160.0000
The price is for reference only, please refer to the actual quotation!

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