
AMD Xilinx
XCZU3EG-2SFVA625I
XCZU3EG-2SFVA625I ECAD Model
XCZU3EG-2SFVA625I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Surface Mount | YES | |
Supply Voltage-Nom | 850 mV | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
Technology | CMOS | |
Supply Voltage-Max | 876 mV | |
Supply Voltage-Min | 825 mV | |
Temperature Grade | INDUSTRIAL | |
JESD-30 Code | R-PBGA-B625 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 625 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Package Description | FCBGA-625 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.4 | |
HTS Code | 8542.39.00.01 |
XCZU3EG-2SFVA625I Datasheet Download
XCZU3EG-2SFVA625I Overview
The XCZU3EG-2SFVA625I chip model is a powerful and versatile semiconductor device that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, which is an important tool for engineers and scientists to design, develop, and verify semiconductor devices.
The XCZU3EG-2SFVA625I chip model has the potential to revolutionize the way we think about embedded processing, image processing, and other applications. As technology advances, the XCZU3EG-2SFVA625I chip model can be used in a variety of new and exciting ways. For example, it can be used to power networks and intelligent systems, such as self-driving cars, autonomous drones, and smart homes.
The XCZU3EG-2SFVA625I chip model can also be used in the era of fully intelligent systems. In this era, the XCZU3EG-2SFVA625I chip model can be used to develop systems that are capable of learning and adapting to their environment. This could include artificial intelligence systems that are capable of making decisions, learning from experience, and responding to their environment.
In order to make the most of the XCZU3EG-2SFVA625I chip model, it is important to understand the industry trends and the future development of related industries. As technology advances, new technologies may be needed to support the XCZU3EG-2SFVA625I chip model in its application environment. This could include the development of more efficient algorithms, the integration of new sensors, and the use of new materials.
Overall, the XCZU3EG-2SFVA625I chip model is a powerful and versatile semiconductor device that has the potential to revolutionize the way we think about embedded processing, image processing, and other applications. With the right technologies and industry trends, the XCZU3EG-2SFVA625I chip model can be used to power networks and intelligent systems, as well as to develop fully intelligent systems in the future.
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5,074 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $504.8784 | $504.8784 |
10+ | $499.4496 | $4,994.4960 |
100+ | $472.3056 | $47,230.5600 |
1000+ | $445.1616 | $222,580.8000 |
10000+ | $407.1600 | $407,160.0000 |
The price is for reference only, please refer to the actual quotation! |