AMD Xilinx
XCZU3EG-2SFVA625E
XCZU3EG-2SFVA625E ECAD Model
XCZU3EG-2SFVA625E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | OTHER | |
| JESD-30 Code | R-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 625 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Seated Height-Max | 3.43 mm | |
| Width | 21 mm | |
| Length | 21 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA625,25X25,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2017-02-15 |
XCZU3EG-2SFVA625E Datasheet Download
XCZU3EG-2SFVA625E Overview
The XCZU3EG-2SFVA625E chip model is a powerful, cutting-edge tool that offers a wide range of advantages for various industries. This chip model is designed to provide high-performance and low-power solutions for a variety of applications, including networking, computing, and storage. It also provides a robust feature set that enables a broad range of applications and scenarios.
The XCZU3EG-2SFVA625E chip model is designed to be highly scalable and customizable, allowing for a wide range of applications and usage scenarios. It is built with a powerful, multi-core processor and features an array of memory and storage options, as well as a wide variety of I/O and communication interfaces. This chip model is also designed to be highly efficient, with low power consumption and low latency.
The XCZU3EG-2SFVA625E chip model is expected to see increased demand in the future, as more and more applications, such as machine learning, artificial intelligence, and the Internet of Things, become increasingly popular. This chip model is also expected to be used in more advanced communication systems, such as 5G and beyond, as the technology continues to advance.
The XCZU3EG-2SFVA625E chip model is capable of being used in a variety of networks and intelligent scenarios. It is capable of providing high-speed, low-latency, and secure connections for a variety of applications. It can also be used in the era of fully intelligent systems, as it is designed to be highly scalable and customizable.
The XCZU3EG-2SFVA625E chip model is designed to be highly reliable and secure, and it is capable of being upgraded in the future. This chip model is expected to be used in a wide range of applications and scenarios, and it is expected to be a powerful tool for businesses and individuals in the future.
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5,191 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $442.0104 | $442.0104 |
| 10+ | $437.2576 | $4,372.5760 |
| 100+ | $413.4936 | $41,349.3600 |
| 1000+ | $389.7296 | $194,864.8000 |
| 10000+ | $356.4600 | $356,460.0000 |
| The price is for reference only, please refer to the actual quotation! | ||