AMD Xilinx
XCZU3EG-1SFVA625I
XCZU3EG-1SFVA625I ECAD Model
XCZU3EG-1SFVA625I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Surface Mount | YES | |
| Supply Voltage-Nom | 850 mV | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Technology | CMOS | |
| Supply Voltage-Max | 876 mV | |
| Supply Voltage-Min | 825 mV | |
| Temperature Grade | INDUSTRIAL | |
| JESD-30 Code | R-PBGA-B625 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 625 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA625,25X25,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.4 | |
| HTS Code | 8542.39.00.01 |
XCZU3EG-1SFVA625I Datasheet Download
XCZU3EG-1SFVA625I Overview
The XCZU3EG-1SFVA625I is a powerful and versatile chip model that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a highly specialized chip model that requires the use of HDL language to program and operate. This chip model is designed for the purpose of providing a high-performance solution for a wide range of applications, from basic communication systems to more advanced ones.
The original design intention of the XCZU3EG-1SFVA625I was to provide a powerful and versatile solution for a variety of applications. It is designed to be easily upgradable and customizable, allowing users to tailor their solutions to their specific needs. It is also capable of handling a wide range of data types and formats, making it suitable for a wide range of applications.
The product description of the XCZU3EG-1SFVA625I includes the chip model's features and specifications, including its processing power, memory, and I/O capabilities. It also includes a comprehensive list of design requirements, such as the type of HDL language to be used and the types of data formats that can be handled. Additionally, the product description includes case studies and precautions to ensure that users are able to safely and effectively use the chip model.
The XCZU3EG-1SFVA625I is a powerful and versatile chip model that is designed for a wide range of applications, from basic communication systems to more advanced ones. It is capable of handling a wide range of data types and formats, making it suitable for a variety of applications. Additionally, it is designed to be easily upgradable and customizable, allowing users to tailor their solutions to their specific needs. With its comprehensive product description and design requirements, users are able to safely and effectively use the chip model.
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1,107 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $394.6176 | $394.6176 |
| 10+ | $390.3744 | $3,903.7440 |
| 100+ | $369.1584 | $36,915.8400 |
| 1000+ | $347.9424 | $173,971.2000 |
| 10000+ | $318.2400 | $318,240.0000 |
| The price is for reference only, please refer to the actual quotation! | ||