XCZU3EG-1SFVC784E
XCZU3EG-1SFVC784E
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rohs

AMD Xilinx

XCZU3EG-1SFVC784E


XCZU3EG-1SFVC784E
F20-XCZU3EG-1SFVC784E
Active
CMOS, BGA, BGA78428X28,32
BGA, BGA78428X28,32

XCZU3EG-1SFVC784E ECAD Model


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XCZU3EG-1SFVC784E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade OTHER
JESD-30 Code R-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA78428X28,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU3EG-1SFVC784E Datasheet Download


XCZU3EG-1SFVC784E Overview



The XCZU3EG-1SFVC784E chip model is a powerful and versatile device designed to meet the needs of advanced communication systems. It is designed to provide a cost-effective and reliable solution for the development of next-generation networks and intelligent systems. With its advanced features and capabilities, it is capable of being used in a variety of applications, from high-speed communication networks to intelligent systems.


The XCZU3EG-1SFVC784E chip model is designed to be upgradable, allowing for future upgrades and improvements. This makes it an ideal platform for the development of intelligent systems, as it can be easily adapted to new technologies and applications. It is also capable of being used in the era of fully intelligent systems, allowing for the development of sophisticated artificial intelligence systems.


The XCZU3EG-1SFVC784E chip model is also capable of being used in the development and popularization of future intelligent robots. With its powerful and versatile capabilities, it can be used to create robots that are capable of performing complex tasks and interacting with humans. In order to use the model effectively, it is important to have a good understanding of the underlying technologies and the necessary technical skills.


In conclusion, the XCZU3EG-1SFVC784E chip model is a powerful and versatile device that is designed for the development of advanced communication systems and intelligent systems. It is capable of being used in a variety of applications, from high-speed communication networks to intelligent systems, and is upgradable for future upgrades and improvements. It is also capable of being used in the development and popularization of future intelligent robots, and requires a good understanding of the underlying technologies and the necessary technical skills to use it effectively.



4,378 In Stock


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Unit Price: $1,496.749
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,391.9766 $1,391.9766
10+ $1,377.0091 $13,770.0908
100+ $1,302.1716 $130,217.1630
1000+ $1,227.3342 $613,667.0900
10000+ $1,122.5618 $1,122,561.7500
The price is for reference only, please refer to the actual quotation!

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