XCZU2EG-1SFVC784I
XCZU2EG-1SFVC784I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCZU2EG-1SFVC784I


XCZU2EG-1SFVC784I
F20-XCZU2EG-1SFVC784I
Active
CMOS, BGA, BGA78428X28,32
BGA, BGA78428X28,32

XCZU2EG-1SFVC784I ECAD Model


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XCZU2EG-1SFVC784I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Surface Mount YES
Supply Voltage-Nom 850 mV
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Technology CMOS
Supply Voltage-Max 876 mV
Supply Voltage-Min 825 mV
Temperature Grade INDUSTRIAL
JESD-30 Code R-PBGA-B784
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Package Description BGA, BGA78428X28,32
Reach Compliance Code compliant
ECCN Code 5A002.A.4
HTS Code 8542.39.00.01

XCZU2EG-1SFVC784I Datasheet Download


XCZU2EG-1SFVC784I Overview



The XCZU2EG-1SFVC784I chip model is a cutting-edge integrated circuit (IC) developed by Xilinx, Inc. It is a highly integrated, high-performance, low-power FPGA with a wide range of applications. This model is designed to provide high-speed, low-power operation with a wide range of features, such as integrated memory, high-speed transceivers, and configurable logic blocks.


The XCZU2EG-1SFVC784I has many advantages, including its low-power consumption, high-speed operation, and integrated memory. It also offers a wide range of features, such as configurable logic blocks, high-speed transceivers, and high-performance DSPs. This makes it an ideal choice for a variety of applications, such as embedded systems, data centers, and cloud computing.


The demand for the XCZU2EG-1SFVC784I chip model is expected to increase in the future, as more and more industries are adopting this technology. This is due to the fact that it is a highly reliable, low-power, and high-performance IC that can be used in a wide variety of applications.


The XCZU2EG-1SFVC784I chip model can be applied to networks and intelligent scenarios in the future. It can be used to build intelligent systems that can process data quickly and accurately. It can also be used in the era of fully intelligent systems, as it is highly reliable and can be used to build complex systems with a wide range of features.


The XCZU2EG-1SFVC784I chip model has specific design requirements that must be met in order to ensure its proper operation. These requirements include the power supply voltage, the clock frequency, the number of I/O pins, the number of logic blocks, and the number of transceivers. It is important to ensure that these requirements are met in order to ensure the proper operation of the chip model.


There are several case studies that demonstrate the effectiveness of the XCZU2EG-1SFVC784I chip model. These case studies show that it can be used to build highly reliable and efficient systems. They also demonstrate the importance of meeting the design requirements of the chip model in order to ensure its proper operation.


When using the XCZU2EG-1SFVC784I chip model, it is important to take certain precautions. These precautions include ensuring that the power supply voltage is within the specified range, that the clock frequency is within the specified range, and that the number of I/O pins, logic blocks, and transceivers are within the specified range. It is also important to ensure that the chip model is properly cooled and that it is not exposed to any environmental hazards.


Overall, the XCZU2EG-1SFVC784I chip model is a highly reliable, low-power, and high-performance IC that can be used in a wide variety of applications. It has many advantages, including its low-power consumption, high-speed operation, and integrated memory. The demand for this chip model is expected to increase in the future, as more and more industries are adopting this technology. It can be applied to networks and intelligent scenarios in the future, and it can be used in the era of fully intelligent systems. It is important to ensure that the design requirements of the chip model are met in order to ensure its proper operation, and certain precautions must be taken when using it.



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Unit Price: $279.76
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $260.1768 $260.1768
10+ $257.3792 $2,573.7920
100+ $243.3912 $24,339.1200
1000+ $229.4032 $114,701.6000
10000+ $209.8200 $209,820.0000
The price is for reference only, please refer to the actual quotation!

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