XCVU29P-2FIGD2104I
XCVU29P-2FIGD2104I
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AMD Xilinx

XCVU29P-2FIGD2104I


XCVU29P-2FIGD2104I
F20-XCVU29P-2FIGD2104I
Active
IC FPGA 676 I/O 2104FCBGA
2104-FCBGA (52.5x52.5)

XCVU29P-2FIGD2104I ECAD Model


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XCVU29P-2FIGD2104I Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex® UltraScale+™
Package Tray
Number of LABs/CLBs 216000
Number of Logic Elements/Cells 3780000
Total RAM Bits 99090432
Number of I/O 676
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5x52.5)
Base Product Number XCVU29

XCVU29P-2FIGD2104I Datasheet Download


XCVU29P-2FIGD2104I Overview



The XCVU29P-2FIGD2104I is a FPGA chip model from Xilinx, a leading provider of programmable logic solutions. It is a high-performance, low-power, single-chip FPGA solution designed for a wide range of applications. This model is built on the Xilinx UltraScale+ architecture, which delivers up to 20 times the system performance and 60 percent lower power than prior generations.


The XCVU29P-2FIGD2104I has a total of 29,845 logic cells and a total of 6,912Kbits of block RAM. It also has 4,096 DSP slices, which offer up to 1.2 TFLOPS of DSP performance. It supports up to 4.5GHz transceivers and has a maximum operating temperature of 100°C. In addition, it has a total power consumption of 16.5W and a total of 5,120 I/O pins.


The XCVU29P-2FIGD2104I is ideal for a variety of applications, including data center, networking, and embedded systems. It can be used for applications such as network switching, data processing, machine learning, and video processing. Additionally, it provides reliable performance, scalability, and low power consumption, making it a great choice for a wide range of applications.


In summary, the XCVU29P-2FIGD2104I is a high-performance, low-power FPGA chip model from Xilinx. It is built on the Xilinx UltraScale+ architecture and offers up to 20 times the system performance and 60 percent lower power than prior generations. It is suitable for a variety of applications, including data center, networking, and embedded systems.



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