XCVU13P-3FHGB2104E

The XCVU13P-3FHGB2104E is a high-performance, low-power, field-programmable gate array (FPGA) chip from Xilinx. It is based on the Virtex UltraScale+ family of FPGAs and is designed to meet the demands of high-end applications such as artificial intelligence, machine learning, and 5G communication.

The chip offers a wide range of features and capabilities, including up to 13.3 million logic cells, 5,120 DSP slices, and up to 1,024 Kb of block RAM. It also supports up to 8,192 I/O pins and up to 7,680 user I/O pins. Additionally, the chip supports up to 12 transceivers, with data rates up to 28Gbps.

The XCVU13P-3FHGB2104E is suitable for a variety of applications, including high-performance computing, networking, storage, and image processing. It can also be used in applications such as deep learning, computer vision, and autonomous vehicles.

In terms of power consumption, the chip offers a low power design, with an estimated power dissipation of up to 35W. The chip also supports a wide range of operating temperatures, ranging from -40°C to +125°C.

Overall, the XCVU13P-3FHGB2104E is a powerful and versatile FPGA chip, suitable for a range of high-end applications. It offers a wide range of features, including high logic cell counts, fast transceivers, and low power consumption. It is also suitable for a variety of applications, including high-performance computing, networking, storage, and image processing.