XCVU13P-3FHGC2104E

The XCVU13P-3FHGC2104E is a high-performance Field Programmable Gate Array (FPGA) chip from Xilinx. It is a member of the Xilinx Versal AI Core series and is based on the Xilinx UltraScale+ architecture.

The XCVU13P-3FHGC2104E features a total of 4,104 logic cells, a total of 1,664,672 logic elements, and a total of 1,024 kbits of embedded memory. It is designed to provide high-performance computing and data processing capabilities with low power consumption. It also features a total of 28,672 digital signal processing (DSP) slices, which can be used for applications such as image processing and machine learning.

The XCVU13P-3FHGC2104E is suitable for a range of applications, including embedded systems, artificial intelligence (AI), machine learning, data processing, and high-performance computing. It is also suitable for applications such as video processing, high-speed networking, and edge computing.

The chip is available in a range of packages, including a flip-chip ball grid array (FCBGA) and a chip-scale package (CSP). It has an operating temperature range of 0°C to 85°C and can operate at a maximum clock frequency of 1.5GHz. It also features a total of 8 high-speed transceivers, which can be used to support a range of protocols such as PCIe, Ethernet, USB, and SATA.

Overall, the XCVU13P-3FHGC2104E is an advanced FPGA chip that is suitable for a range of applications, including embedded systems, AI, data processing, and high-performance computing. It has high-performance computing and data processing capabilities with low power consumption, and features a total of 28,672 DSP slices. It is available in a range of packages and can operate at a maximum clock frequency of 1.5GHz.