XCVU27P-L2FIGD2104E

The XCVU27P-L2FIGD2104E is a Field Programmable Gate Array (FPGA) chip designed by Xilinx, Inc. It is a high-performance, high-density FPGA chip with a 28nm UltraScale+ architecture. This chip is designed for applications such as high-performance computing, storage, networking, and communications.

The XCVU27P-L2FIGD2104E chip has a total of 27,648 logic cells, and offers up to 2.04 million logic elements (LEs). It also supports up to 1,144 user I/O pins, and up to 8GB of DDR4 SDRAM. It includes a high-speed transceiver with a data rate of up to 28.05 Gbps. It also supports a wide range of protocols, such as PCIe Gen3, 10G/25G Ethernet, and SRIO Gen2.

The chip features a low power design, and can operate at a voltage of 1.2V or 1.3V. It also supports an advanced power management system, which allows it to switch between various power states depending on the application. It also has a built-in thermal management system, which helps to keep the chip at an optimal temperature.

The XCVU27P-L2FIGD2104E chip is ideal for use in high-performance computing, storage, networking, and communications applications. It can be used in a variety of applications, such as data centers, cloud computing, automotive, industrial, and military applications. It is also suitable for use in artificial intelligence and machine learning applications.