XCVU19P-2FSVB3824E

The XCVU19P-2FSVB3824E is a high-performance, low-power, field programmable gate array (FPGA) chip model. This chip is manufactured by Xilinx, a leading provider of programmable logic solutions.

The XCVU19P-2FSVB3824E is designed for use in a wide range of applications, including industrial, automotive, aerospace, and medical. It features a 28nm UltraScale+ architecture with up to 1.92 million logic cells, up to 18.5Mb of block RAM, and up to 8GB of DDR4 memory. It also includes a high-speed transceiver with up to 28.8Gbps of bandwidth and up to 28 transceivers.

The chip has an operating voltage range of 0.85V to 1.15V and a maximum power dissipation of 17.5W. It is designed to operate at a maximum temperature of 100°C. The chip is also designed to be reliable and robust, with an MTTF of up to 200 years.

The XCVU19P-2FSVB3824E is suitable for a range of applications, including high-speed networking, data center acceleration, video processing, and embedded systems. It can be used for a variety of tasks, including image and video processing, signal processing, and artificial intelligence. It can also be used for high-speed data transfer and storage, as well as for system-level integration.