XCVU19P-1FSVA3824E

The XCVU19P-1FSVA3824E is an advanced and highly integrated field programmable gate array (FPGA) chip model from Xilinx. It is a single-chip solution that combines the processing power of a high-end FPGA with the flexibility of a programmable logic device. The XCVU19P-1FSVA3824E provides up to 19.2 TeraFLOPS of floating-point performance and up to 1.6 TeraBytes of on-chip memory. It features an array of programmable logic blocks, DSP blocks, and memory blocks for high-performance applications.

The XCVU19P-1FSVA3824E is built on the Xilinx UltraScale+ architecture, offering up to 2.5 times the performance of the previous generation. It has a total of 2.5 million logic cells, 1.6 million flip-flops, and 1.2 million RAM blocks. Additionally, it features up to 16 GB of DDR4 memory and up to 32 Gbps Serial Transceivers.

The XCVU19P-1FSVA3824E is ideal for a variety of applications, including high-performance computing, machine learning and artificial intelligence, video processing, and embedded systems. It is suitable for use in data center, automotive, industrial, and 5G applications.

The XCVU19P-1FSVA3824E is available in a range of packages, including the VFQFPN, FCBGA, and CABGA packages. It is designed to operate at a temperature range of -40°C to +85°C and is rated for a maximum junction temperature of 125°C. It is also RoHS compliant, making it suitable for use in a wide range of applications.