XCVU13P-2FHGC2104E

The XCVU13P-2FHGC2104E is an advanced Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is a high-performance, low-power, and cost-effective FPGA solution.

The XCVU13P-2FHGC2104E is a high-performance FPGA chip with a high-density logic cell and a wide range of features such as a hardened floating-point unit (FPU), a hardened memory controller, and a hardened PCIe Gen3x16 interface. It supports up to 4.5 million system logic cells, up to 8.5 million memory bits, and up to 1.2 million digital signal processing (DSP) slices. The chip is optimized for high-performance applications such as artificial intelligence (AI), machine learning (ML), and 5G wireless communications.

The XCVU13P-2FHGC2104E supports a wide range of I/O standards including LVDS, MIPI, and PCIe. It also supports up to 28 Gbps transceivers for high-speed communication and up to 1.2 Gbps DDR4 for high-performance memory access. The chip supports multiple power domains and has a low-power standby mode to conserve power.

The XCVU13P-2FHGC2104E is suitable for a wide range of applications including wireless communications, industrial automation, automotive, military, and aerospace. It is also suitable for high-performance computing, AI, ML, and 5G applications. The chip is also ideal for embedded applications that require low latency and high performance.