XCVU13P-1FHGB2104I

The XCVU13P-1FHGB2104I chip model is a Field Programmable Gate Array (FPGA) device manufactured by Xilinx, Inc. It is a mid-range device that is suitable for a wide range of applications.

The XCVU13P-1FHGB2104I chip model has a Virtex UltraScale+ architecture with a total of 13.1 million logic cells. It has a total of 32.8Mb of UltraRAM, 1.5Mb of Block RAM, and up to 4.5Tb/s of total bandwidth. It also has up to 8,388,608 logic elements, 1,024 DSP slices, and up to 2,048 18x18 multipliers. The chip also has up to 4,096 18x18 multipliers with full precision, and up to 8,192 DSP slices.

The chip model also has a wide range of I/O options, including up to 5,120 differential I/O pairs, up to 4,096 single-ended I/O pairs, up to 4,096 LVDS pairs, and up to 1,024 transceivers. It also has up to 4,096 user I/O pins, up to 4,096 global clock networks, and up to 1,024 clock networks.

The XCVU13P-1FHGB2104I chip model is suitable for applications such as high-performance computing, machine learning, data center acceleration, security solutions, video processing, and embedded systems. It is also suitable for use in a variety of industries, including automotive, aerospace, medical, industrial, and consumer electronics.

In conclusion, the XCVU13P-1FHGB2104I chip model is a powerful and versatile FPGA device that is suitable for a wide range of applications. With its high performance and wide range of I/O options, it is an ideal choice for a variety of industries.