XCVU13P-1FHGB2104E

The XCVU13P-1FHGB2104E chip model is a Field Programmable Gate Array (FPGA) that is manufactured by Xilinx. It is built on the company’s UltraScale+ architecture and comes in a 21x21 mm, flip-chip BGA package. This chip model includes a total of 104 transceivers, 1,344 user I/Os, and 4,096 Kbits of block RAM.

The XCVU13P-1FHGB2104E offers a wide range of features that make it suitable for a wide range of applications. It has a wide operating temperature range of -40 to +85 degrees Celsius, making it suitable for industrial applications. It also has a maximum power dissipation of 10.5W and a maximum dynamic power of 8.2W. It also has a maximum static power of 1.3W.

The XCVU13P-1FHGB2104E is suitable for a wide range of applications, including high-speed networking, data center acceleration, broadcast video processing, and high-performance computing. It can also be used for embedded vision and industrial automation. It is also suitable for applications such as 5G wireless base stations, artificial intelligence, and machine learning.

In summary, the XCVU13P-1FHGB2104E is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It has a wide operating temperature range, maximum power dissipation of 10.5W, and a maximum static power of 1.3W. It is suitable for a wide range of applications, including high-speed networking, data center acceleration, broadcast video processing, and high-performance computing.