AMD Xilinx
XCV800-6BG560I
XCV800-6BG560I ECAD Model
XCV800-6BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 21168 | |
| Number of Equivalent Gates | 888439 | |
| Number of CLBs | 4704 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4704 CLBS, 888439 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV800-6BG560I Datasheet Download
XCV800-6BG560I Overview
The chip model XCV800-6BG560I is a cutting-edge integrated circuit (IC) that is designed to meet the needs of a wide range of applications. It is a powerful, high-performance, and low-power solution for a variety of applications. This model is characterized by its high-speed data transfer rates, low power consumption, and small form factor.
The XCV800-6BG560I is a highly integrated single-chip solution, which is ideal for applications that require a high degree of integration, such as medical imaging, automotive, industrial, and consumer electronics. It is also suitable for applications that require high-speed data transfer, such as high-speed communications, video streaming, and multimedia. The XCV800-6BG560I is designed with an advanced architecture that is optimized for both performance and power efficiency.
The XCV800-6BG560I offers a wide range of features and benefits, including a high-speed data transfer rate of up to 6Gbps, low power consumption, and a small form factor. It also offers a high degree of integration, which is ideal for applications that require a high degree of integration. In addition, the XCV800-6BG560I is designed to be compatible with a wide range of operating systems and platforms, making it an ideal solution for a variety of applications.
The XCV800-6BG560I is expected to be in high demand in the future, as it is a powerful and efficient solution for a variety of applications. It is also expected to be used in a wide range of industries, such as automotive, medical imaging, industrial, and consumer electronics. The XCV800-6BG560I is designed to meet the needs of both current and future applications, and is expected to be a popular choice in the future.
The XCV800-6BG560I is designed with a range of features and benefits. It is designed to be compatible with a wide range of operating systems and platforms, and is optimized for both performance and power efficiency. It is also designed to be highly integrated, making it ideal for applications that require a high degree of integration. Additionally, the XCV800-6BG560I is designed to be compatible with a wide range of new technologies, making it an ideal solution for applications that require the support of new technologies.
When using the XCV800-6BG560I, it is important to consider the product description and specific design requirements. This includes the operating systems and platforms that the XCV800-6BG560I is compatible with, as well as the power requirements and other technical specifications. In addition, it is important to consider the actual case studies and precautions when using the XCV800-6BG560I.
In conclusion, the XCV800-6BG560I is a powerful, high-performance, and low-power solution for a variety of applications. It is designed to be compatible with a wide range of operating systems and platforms, and is optimized for both performance and power efficiency. It is also designed to be highly integrated, making it ideal for applications that require a high degree of integration. Additionally, the XCV800-6BG560I is designed to be compatible with a wide range of new technologies, making it an ideal solution for applications that require the support of new technologies. The XCV800-6BG560I is expected to be in high demand in the future, and is expected to be a popular choice in the future.
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1,830 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $279.0000 | $279.0000 |
| 10+ | $276.0000 | $2,760.0000 |
| 100+ | $261.0000 | $26,100.0000 |
| 1000+ | $246.0000 | $123,000.0000 |
| 10000+ | $225.0000 | $225,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||