AMD Xilinx
XCV600E-8BGG560C
XCV600E-8BGG560C ECAD Model
XCV600E-8BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV600E-8BGG560C Datasheet Download
XCV600E-8BGG560C Overview
The XCV600E-8BGG560C is a high-performance chip model designed for digital signal processing, embedded processing, and image processing. This chip model is a great choice for those looking to maximize their performance and optimize their processing power. It is also suitable for applications that require the use of HDL language.
The XCV600E-8BGG560C is a powerful chip model that offers many advantages. It has a high-speed processor, advanced memory, and a wide range of peripheral interfaces. It also has a low power consumption and a high level of reliability. This chip model is designed to meet the needs of various applications and can be used in a variety of scenarios.
The industry trends of the chip model XCV600E-8BGG560C are constantly changing and evolving. As technology advances, new technologies are being developed to support the application environment. This chip model is designed to take advantage of these new technologies and provide users with the best performance possible.
When it comes to product description and design requirements, the XCV600E-8BGG560C is designed to be flexible and customizable. It has a variety of options and features that can be tailored to meet the needs of any application. It also has a wide range of peripherals and interfaces that can be used to further increase its performance.
The XCV600E-8BGG560C is a powerful chip model that can be used in a variety of applications. However, when using this chip model, it is important to take into account the specific design requirements and actual case studies. This will help ensure that the chip model works properly and that the application environment is optimized for maximum performance. Additionally, it is important to be aware of any potential risks or issues associated with the chip model and to take the necessary precautions to ensure that the application is secure and reliable.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||