AMD Xilinx
XCV600E-7BGG560I
XCV600E-7BGG560I ECAD Model
XCV600E-7BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV600E-7BGG560I Datasheet Download
XCV600E-7BGG560I Overview
The XCV600E-7BGG560I chip model is a powerful digital signal processor (DSP) that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is a powerful and efficient processor that requires the use of HDL language.
The XCV600E-7BGG560I chip model has many advantages over other processors. It has a high processing speed, a low power consumption, and a small size. It also has a wide range of features, such as an enhanced instruction set, a built-in memory controller, and a large number of peripherals. These features make it ideal for applications that require high performance and low power consumption.
The XCV600E-7BGG560I chip model is expected to be in high demand in the coming years due to its advantages. It is expected to be used in a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is also expected to be used in advanced communication systems, such as 5G.
The original design intention of the XCV600E-7BGG560I chip model was to provide a powerful and efficient processor for a wide range of applications. It has been designed to be able to handle a wide range of tasks and to be able to process data quickly and efficiently. It is also designed to be able to be upgraded in the future, allowing it to be used in more advanced applications.
The XCV600E-7BGG560I chip model is a powerful and efficient processor that is suitable for a wide range of applications. It has many advantages, such as a high processing speed, a low power consumption, and a small size. It is expected to be in high demand in the coming years and can be used in advanced communication systems, such as 5G. The original design intention of the chip model was to provide a powerful and efficient processor for a wide range of applications and can be upgraded in the future to be used in more advanced applications.
You May Also Be Interested In
4,441 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||