AMD Xilinx
XCV600E-7BGG560C
XCV600E-7BGG560C ECAD Model
XCV600E-7BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV600E-7BGG560C Datasheet Download
XCV600E-7BGG560C Overview
The chip model XCV600E-7BGG560C is an advanced semiconductor device that has been developed to meet the needs of the ever-evolving technology market. It is a powerful chip that can handle a variety of tasks and processes, while also being highly energy efficient. It is designed to be used in a variety of communication systems, making it a versatile and reliable choice for many different applications.
The chip model XCV600E-7BGG560C is designed to be able to handle a wide range of tasks and processes, making it an ideal choice for many different applications. It is capable of handling complex data processing tasks, as well as being highly energy efficient. It is also designed to be able to handle a variety of communication systems, making it a great choice for many different applications.
Due to its versatility and reliability, the chip model XCV600E-7BGG560C is an ideal choice for many different applications. It can be used in networks to provide high-speed data transfer, and can also be used in intelligent scenarios to provide advanced features and capabilities. It is also capable of being used in the era of fully intelligent systems, making it a great choice for many different applications.
The chip model XCV600E-7BGG560C is designed to be able to handle a variety of tasks and processes, making it a great choice for many different applications. Its original design intention was to be able to provide a reliable and powerful chip that could handle a variety of tasks and processes, while also being highly energy efficient. It is also designed to be able to handle a variety of communication systems, making it a great choice for many different applications.
The chip model XCV600E-7BGG560C is designed to be able to handle a variety of tasks and processes, making it a great choice for many different applications. It is also designed to be able to handle a variety of communication systems, making it a great choice for many different applications. It is also capable of being upgraded in the future, making it an ideal choice for many different applications.
The chip model XCV600E-7BGG560C is a powerful chip that can handle a variety of tasks and processes, while also being highly energy efficient. It is designed to be used in a variety of communication systems, making it a versatile and reliable choice for many different applications. It is also capable of being used in networks to provide high-speed data transfer, and can also be used in intelligent scenarios to provide advanced features and capabilities. It is also capable of being used in the era of fully intelligent systems, making it a great choice for many different applications.
In conclusion, the chip model XCV600E-7BGG560C is a powerful and reliable chip that can handle a variety of tasks and processes, while also being highly energy efficient. It is designed to be used in a variety of communication systems, making it a versatile and reliable choice for many different applications. It is also capable of being upgraded in the future, making it an ideal choice for many different applications. It is also capable of being used in networks to provide high-speed data transfer, and can also be used in intelligent scenarios to provide advanced features and capabilities. It is also capable of being used in the era of fully intelligent systems, making it a great choice for many different applications.
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