AMD Xilinx
XCV600E-6BGG560C
XCV600E-6BGG560C ECAD Model
XCV600E-6BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 186624 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 186624 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV600E-6BGG560C Datasheet Download
XCV600E-6BGG560C Overview
The XCV600E-6BGG560C chip model is an advanced integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing, among other applications. It is a powerful tool that enables users to build sophisticated systems and solutions, and requires the use of HDL language.
In terms of industry trends, the XCV600E-6BGG560C chip model is a versatile solution that can be used in a wide range of applications. It is capable of supporting the latest technologies and applications, such as artificial intelligence, machine learning, and natural language processing. As such, it is an important component in the development of next-generation intelligent robots.
Regarding the application of the XCV600E-6BGG560C chip model for the development and popularization of future intelligent robots, it is necessary to have a comprehensive understanding of the technologies involved, such as artificial intelligence and machine learning. In addition, technical talents with a deep understanding of the chip model and its capabilities are needed to effectively use the model. These talents should possess strong programming skills and have experience in the design and implementation of embedded systems.
Overall, the XCV600E-6BGG560C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is capable of supporting the latest technologies and applications, and is an important component in the development of next-generation intelligent robots. To effectively use the model, technical talents with strong programming skills and experience in the design and implementation of embedded systems are needed.
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