AMD Xilinx
XCV600-6BG560I
XCV600-6BG560I ECAD Model
XCV600-6BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 15552 | |
| Number of Equivalent Gates | 661111 | |
| Number of CLBs | 3456 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 3456 CLBS, 661111 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV600-6BG560I Datasheet Download
XCV600-6BG560I Overview
The XCV600-6BG560I chip model is a powerful and versatile chip that has been designed for use in high-performance digital signal processing, embedded processing, image processing, and other similar applications. It requires the use of an HDL language, such as VHDL or Verilog, to program the chip. The original design intention of the chip model was to provide a powerful and flexible solution for processing complex digital signals.
The chip model is also capable of being upgraded to provide more features and functions. For example, it can be upgraded to provide support for advanced communication systems. This can enable the chip to be used in networks with high bandwidth requirements and also to be used in intelligent scenarios. The chip can also be used in the era of fully intelligent systems, where it can be used to process large amounts of data in real-time and make decisions based on the data.
The XCV600-6BG560I chip model is a powerful and reliable solution for digital signal processing and embedded processing. It is capable of being upgraded to provide support for advanced communication systems, as well as being used in intelligent scenarios. This makes it an ideal choice for a wide range of applications and enables it to be used in the era of fully intelligent systems.
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4,535 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $735.1605 | $735.1605 |
| 10+ | $727.2556 | $7,272.5558 |
| 100+ | $687.7308 | $68,773.0824 |
| 1000+ | $648.2061 | $324,103.0320 |
| 10000+ | $592.8714 | $592,871.4000 |
| The price is for reference only, please refer to the actual quotation! | ||