AMD Xilinx
XCV50E-8FGG256C
XCV50E-8FGG256C ECAD Model
XCV50E-8FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-8FGG256C Datasheet Download
XCV50E-8FGG256C Overview
The chip model XCV50E-8FGG256C is a cutting-edge technology that has been developed to meet the demands of the modern world. It is a high-performance, low-power, and cost-effective system-on-chip solution that is designed to provide a wide range of features and capabilities for embedded applications. This chip model is designed to deliver superior performance, low power consumption, and reliable operation in a wide range of applications.
The XCV50E-8FGG256C chip model is an advanced technology that is used in many industries. It is used in the automotive, medical, and industrial sectors, as well as in consumer electronics. This chip model is also used in the development of new technologies such as artificial intelligence, robotics, and the Internet of Things. The XCV50E-8FGG256C is also used in the development of autonomous vehicles and other advanced technologies.
The XCV50E-8FGG256C chip model offers a range of advantages that make it suitable for a wide range of applications. It is highly reliable and has a low power consumption, which makes it an ideal choice for embedded applications. In addition, it is highly scalable and can be used for a variety of applications. This chip model is also designed to be flexible and can be customized to meet the specific needs of different applications.
The demand for the XCV50E-8FGG256C chip model is expected to grow in the future as more industries and applications require the use of advanced technologies. This chip model is expected to be used in the development of autonomous vehicles, robotics, and artificial intelligence, as well as in the development of the Internet of Things. It is also expected to be used in the development of new technologies such as augmented reality and virtual reality.
The XCV50E-8FGG256C chip model can be used in the development and popularization of future intelligent robots. It is highly reliable and can be used in the development of autonomous vehicles and other advanced technologies. To use the model effectively, technical talents such as computer scientists, engineers, and programmers are needed. These professionals need to be familiar with the chip model's features and capabilities and should be able to design and develop applications that can make use of the chip model's features and capabilities.
In conclusion, the XCV50E-8FGG256C chip model is a cutting-edge technology that is used in many industries. It is highly reliable, low power consumption, and highly scalable, making it an ideal choice for embedded applications. The demand for this chip model is expected to grow in the future as more industries and applications require the use of advanced technologies. It can be used in the development and popularization of future intelligent robots and requires the support of technical talents such as computer scientists, engineers, and programmers.
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3,531 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $24.1800 | $24.1800 |
| 10+ | $23.9200 | $239.2000 |
| 100+ | $22.6200 | $2,262.0000 |
| 1000+ | $21.3200 | $10,660.0000 |
| 10000+ | $19.5000 | $19,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||