AMD Xilinx
XCV50E-7FGG256C
XCV50E-7FGG256C ECAD Model
XCV50E-7FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV50E-7FGG256C Datasheet Download
XCV50E-7FGG256C Overview
The XCV50E-7FGG256C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It can be used in a wide range of applications, from automotive to medical, and is particularly well-suited for high-performance digital signal processing. It requires the use of HDL language, allowing for more complex tasks to be completed quickly and efficiently.
The XCV50E-7FGG256C chip model has a number of advantages that make it well-suited for its intended applications. It offers a high degree of flexibility, allowing for a wide range of tasks to be completed. It is also able to process data quickly and accurately, making it ideal for high-performance applications. In addition, the chip model is relatively easy to use, making it accessible to engineers of all levels.
The demand for the XCV50E-7FGG256C chip model is likely to increase in the future, as its advantages become more widely known. This is particularly true in the automotive and medical industries, where the need for high-performance digital signal processing is growing. As a result, engineers with knowledge of the chip model will be in high demand, as more businesses look to take advantage of its capabilities.
The XCV50E-7FGG256C chip model can also be applied to the development and popularization of future intelligent robots. Its fast processing capabilities and flexibility make it well-suited for use in robotics, allowing for complex tasks to be completed quickly and accurately. To use the chip model effectively, engineers will need to have a good understanding of HDL language and be able to use it to program robots. In addition, knowledge of robotics and artificial intelligence will be beneficial, as these are integral components of the development of intelligent robots.
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2,779 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $53.4609 | $53.4609 |
| 10+ | $52.8860 | $528.8602 |
| 100+ | $50.0118 | $5,001.1776 |
| 1000+ | $47.1375 | $23,568.7680 |
| 10000+ | $43.1136 | $43,113.6000 |
| The price is for reference only, please refer to the actual quotation! | ||