AMD Xilinx
XCV50E-8CSG144I
XCV50E-8CSG144I ECAD Model
XCV50E-8CSG144I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA144,13X13,32 | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50E-8CSG144I Datasheet Download
XCV50E-8CSG144I Overview
The XCV50E-8CSG144I chip model is a revolutionary product that is revolutionizing the way industries and businesses operate. It is a powerful and versatile chip that has been designed to meet the needs of a variety of industries, from automotive to telecommunications. This chip is designed to be used in advanced communication systems, providing enhanced performance and reliability.
The XCV50E-8CSG144I chip model has many advantages, such as its high speed, low power consumption, and robust design. It is also capable of supporting multiple protocols, such as Ethernet, Wi-Fi, and Bluetooth. This chip is capable of operating at a maximum frequency of up to 8GHz, making it an ideal choice for high-speed applications. Additionally, it is designed to be compatible with a wide range of microcontrollers and other digital devices, allowing for easy integration into existing systems.
The XCV50E-8CSG144I chip model is also designed to be highly reliable and secure, with features such as built-in encryption and authentication protocols. It is also designed to be easily upgradable, allowing for further improvements and enhancements in the future. This chip model is also designed to be compliant with the latest standards, such as the IEEE 802.11ac and the Bluetooth 5.0 specifications.
The XCV50E-8CSG144I chip model is expected to have a high demand in the future, as more businesses and industries become aware of its many advantages. This chip model has the potential to revolutionize the way industries and businesses operate, providing enhanced performance and reliability. In addition, this chip model is also designed to be easily upgradable, allowing for further improvements and enhancements in the future.
In terms of product description and specific design requirements, the XCV50E-8CSG144I chip model is designed to be a highly reliable and secure chip, with features such as built-in encryption and authentication protocols. It is also designed to be compatible with a wide range of microcontrollers and other digital devices, allowing for easy integration into existing systems. Additionally, this chip model is designed to be compliant with the latest standards, such as the IEEE 802.11ac and the Bluetooth 5.0 specifications.
In order to ensure the best performance and reliability of the XCV50E-8CSG144I chip model, it is important to adhere to the design requirements and specifications. It is also important to consider the actual case studies and precautions when using this chip model. For example, it is important to consider the power consumption of the chip and the environment in which it will be used in order to ensure optimal performance. Additionally, it is important to consider the compatibility of the chip with other devices in order to ensure that it can be used in the intended application.
Overall, the XCV50E-8CSG144I chip model is an innovative product that is revolutionizing the way industries and businesses operate. It is a powerful and versatile chip that has been designed to meet the needs of a variety of industries, from automotive to telecommunications. This chip is designed to be used in advanced communication systems, providing enhanced performance and reliability. With its high speed, low power consumption, and robust design, the XCV50E-8CSG144I chip model is expected to have a high demand in the future, and its upgradability makes it an ideal choice for businesses and industries looking for a reliable and secure chip.
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