AMD Xilinx
XCV100E-8CSG144I
XCV100E-8CSG144I ECAD Model
XCV100E-8CSG144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA144,13X13,32 | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV100E-8CSG144I Datasheet Download
XCV100E-8CSG144I Overview
The XCV100E-8CSG144I chip model is a powerful and reliable solution for digital signal processing, embedded processing, image processing, and more. It is designed to be highly flexible, allowing for future upgrades and modifications as needed. The chip is programmed with the HDL language, a high-level programming language used to develop software for digital systems.
The XCV100E-8CSG144I chip model is designed with advanced communication systems in mind. It offers a variety of features to support high-performance digital signal processing, embedded processing, and image processing. Its features include a high-speed processor, a large memory, a variety of I/O ports, and a wide range of peripherals. It also offers a range of power management options, allowing it to be used in a variety of applications.
The product description of the XCV100E-8CSG144I chip model outlines the design requirements and features of the chip. It is designed to be highly reliable and efficient, with a low power consumption and a wide range of features. It is also designed to be highly flexible, allowing for future upgrades and modifications as needed.
The XCV100E-8CSG144I chip model has been used in a variety of applications, from high-performance digital signal processing to embedded processing and image processing. It has been used in a range of applications, from automotive to medical and industrial. In each of these applications, the chip has been used to provide reliable and efficient performance.
When using the XCV100E-8CSG144I chip model, it is important to take into account the specific design requirements and features of the chip. It is also important to consider the power management options and the range of peripherals available. Additionally, it is important to be aware of any potential upgrades or modifications that may be necessary in the future.
Overall, the XCV100E-8CSG144I chip model is a powerful and reliable solution for digital signal processing, embedded processing, image processing, and more. Its design is highly flexible, allowing for future upgrades and modifications as needed. With its range of features and power management options, it is an ideal solution for a variety of applications.
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